M2S100-FC1152
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- Mfr.Part #
- M2S100-FC1152
- Manufacturer
- Microsemi
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 46,713
- In Stock ：
- 46,713
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- Manufacturer :
- Microsemi
- Product Category :
- System On Chip (SoC)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peripherals :
- DDR, PCIe, SERDES
- Height Seated (Max) :
- 2.9mm
- Number of Outputs :
- 574
- Number of Inputs :
- 574
- Core Processor :
- ARM® Cortex®-M3
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Power Supplies :
- 1.2V
- Series :
- SmartFusion®2
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of I/O :
- 574
- RAM Size :
- 64KB
- Supply Voltage-Max (Vsup) :
- 1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.2V
- Frequency :
- 166MHz
- Packaging :
- Tray
- Core Architecture :
- ARM
- JESD-30 Code :
- S-PBGA-B1152
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 1152-BBGA, FCBGA
- Supply Voltage-Min (Vsup) :
- 1.14V
- Flash Size :
- 512kB
- RoHS Status :
- Non-RoHS Compliant
- Primary Attributes :
- FPGA - 100K Logic Modules
- JESD-609 Code :
- e0
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Length :
- 35mm
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Published :
- 2009
- Surface Mount :
- yes
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Number of Logic Cells :
- 99512
- Architecture :
- MCU, FPGA
- Width :
- 35mm
- Base Part Number :
- M2S100
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Datasheets
- M2S100-FC1152
0°C~85°C TJ M2S100 System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 100K Logic Modules.Housed in the state-of-art Tray package.574 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.You can have 574 user outputs for this SoC chip.System on chip requires 1.2V power supplies.574 inputs are available on the SoC chip.Logic system on chips features 99512 logic cells.It has a 512KB flash.You can get system on chips with similar specs and purposes by searching M2S100.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S100-FC1152 System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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