M2S150-1FC1152
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- Mfr.Part #
- M2S150-1FC1152
- Manufacturer
- Microchip Technology
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 1152BGA
- Stock
- 22,023
- In Stock ：
- 22,023
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- HTS Code :
- 8542.39.00.01
- Interface :
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Core Architecture :
- ARM
- Published :
- 2009
- Packaging :
- Tray
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Voltage-Max (Vsup) :
- 1.26V
- Package / Case :
- 1152-BBGA, FCBGA
- Peripherals :
- DDR, PCIe, SERDES
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 574
- Supply Voltage-Min (Vsup) :
- 1.14V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B1152
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Primary Attributes :
- FPGA - 150K Logic Modules
- Supply Voltage :
- 1.2V
- Architecture :
- MCU, FPGA
- Flash Size :
- 512kB
- Reach Compliance Code :
- not_compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Outputs :
- 574
- Terminal Pitch :
- 1mm
- Length :
- 35mm
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Factory Lead Time :
- 12 Weeks
- Base Part Number :
- M2S150
- Series :
- SmartFusion®2
- RoHS Status :
- Non-RoHS Compliant
- Core Processor :
- ARM® Cortex®-M3
- Height Seated (Max) :
- 2.9mm
- Frequency :
- 166MHz
- Operating Temperature :
- 0°C~85°C TJ
- Number of I/O :
- 574
- Surface Mount :
- yes
- Width :
- 35mm
- Number of Logic Cells :
- 146124
- RAM Size :
- 64KB
- Power Supplies :
- 1.2V
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Datasheets
- M2S150-1FC1152
0°C~85°C TJ M2S150 System On Chip SmartFusion®2 Series 574 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 1152-BBGA, FCBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 150K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 574.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is possible to use this SoC chip with 574 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 574 inputs is available to the user.146124 logic cells are included in logic system on chips.There is a flash of 512KB.Searching M2S150 will yield system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S150-1FC1152 System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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