LPC55S06JBD64E

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Mfr.Part #
LPC55S06JBD64E
Manufacturer
NXP Semiconductors
Package / Case
64-TQFP Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 64HTQFP
Stock
968
In Stock :
968

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Maximum Clock Rate (MHz) :
96
Product Status :
Active
Ethernet :
0
Minimum Operating Supply Voltage (V) :
1.8
Number of I/Os :
45 I/O
Maximum CPU Frequency (MHz) :
96
Data Converters :
A/D 9x16b SAR
Package Height :
1.05(Max)
Package :
Tray
Product Type :
ARM Microcontrollers - MCU
PCB changed :
64
Number of ADCs :
Single
Core Architecture :
ARM
ECCN (US) :
5A992.C
EEPROM Size :
-
Voltage - Supply (Vcc/Vdd) :
1.8V ~ 3.6V
Interfaces :
CAN, I2C, I2S, SPI, UART, USART
Maximum Operating Temperature :
+ 105 C
Connectivity :
CANbus, Flex COMM, I²C, SPI, UART/USART
Typical Operating Supply Voltage (V) :
3.3
Mounting Type :
Surface Mount
Manufacturer :
NXP
Program Memory Size :
256KB
Program Memory Type :
Flash
Oscillator Type :
Internal
USB :
0
RAM Size :
96kB
SPI :
7
ADC Resolution (bit) :
16
Product Category :
ARM Microcontrollers - MCU
Supplier Package :
HTQFP EP
Pin Count :
64
Minimum Operating Temperature (°C) :
-40
Number of I/O :
45
Mounting :
Surface Mount
No. of Timers :
5
Base Product Number :
LPC55S06
Data Bus Width :
32bit
Brand :
NXP Semiconductors
Device Core :
ARM Cortex M33
Core Processor :
ARM® Cortex®-M33
USART :
8
Data Bus Width (bit) :
32
Operating Temperature :
-40°C ~ 105°C (TA)
Mounting Style :
SMD/SMT
Package Length :
10
RoHS :
Details
Core Size :
32-Bit Single-Core
Minimum Operating Temperature :
- 40 C
I2C :
8
Instruction Set Architecture :
RISC
Series :
LPC55S0x
UART :
0
Interface Type :
CAN/I2C/I2S/SPI/USART
I2S :
8
Package Width :
10
Maximum Operating Supply Voltage (V) :
3.6
Supplier Device Package :
64-HTQFP (10x10)
Peripherals :
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
MSL :
MSL 3 - 168 hours
Maximum Operating Temperature (°C) :
105
Speed :
96MHz
Packaging :
Tray
Subcategory :
Microcontrollers - MCU
Programmability :
yes
Package / Case :
64-TQFP Exposed Pad
RoHS Status :
RoHS Compliant
Datasheets
LPC55S06JBD64E
Introducing Microcontrollers NXP Semiconductors LPC55S06JBD64E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 105°C (TA), Package / Case:64-TQFP Exposed Pad, LPC55S06JBD64E pinout, LPC55S06JBD64E datasheet PDF, LPC55S06JBD64E amp .Beyond Microcontrollers NXP Semiconductors LPC55S06JBD64E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC55S06JBD64E


Microcontrollers NXP Semiconductors LPC55S06JBD64E Overview

The Microcontrollers NXP Semiconductors LPC55S06JBD64E is a powerful 32-bit microcontroller unit (MCU) designed to cater to a wide array of industrial and commercial applications. Featuring 256KB of flash memory and housed in a compact 64-HTQFP package, this MCU offers a blend of performance, power efficiency, and scalability essential for today’s sophisticated electronic applications. The LPC55S06JBD64E stands out with its robust security features and flexible I/O options, making it a prime choice for designers looking to optimize their systems for performance and cost.

LPC55S06JBD64E Features

This MCU includes several features that make it suitable for demanding applications. Key features include its Cortex-M33 core, which provides efficient computation and the ability to run complex algorithms. Additionally, it offers multiple power-saving modes, essential for portable and low-power applications. Its versatile connectivity options, including multiple UARTs, SPI, and I2C channels, allow for excellent integration capabilities with other components in a system design.

LPC55S06JBD64E Applications

  • Industrial Automation: The LPC55S06JBD64E can be utilized in control systems for sensors, actuators, and other machinery, facilitating streamlined and efficient factory operations.
  • Smart Home Devices: This MCU is ideal for integration into smart home systems, powering devices such as smart thermostats and security systems, where reliable operation and connectivity are critical.
  • Wearable Technology: Thanks to its low power consumption and compact size, the LPC55S06JBD64E is perfectly suited for wearable devices, supporting functionalities like health monitoring and activity tracking.
  • Automotive Applications: Employed in automotive subsystems for engine management and infotainment systems, this MCU helps in enhancing vehicle performance and driver experience.
  • Internet of Things (IoT): With its ability to handle multiple I/O operations and robust security features, the LPC55S06JBD64E is an excellent choice for IoT devices, ensuring secure and reliable data handling.
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