LPC1777FBD208,551

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Mfr.Part #
LPC1777FBD208,551
Manufacturer
NXP Semiconductors
Package / Case
208-LQFP
Datasheet
Download
Description
IC MCU 32BIT 512KB FLASH 208LQFP
Stock
4,275
In Stock :
4,275

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
DAC Channels :
yes
Published :
2010
Has ADC :
yes
Oscillator Type :
Internal
Core Processor :
ARM® Cortex®-M3
Clock Frequency :
25MHz
ROM (words) :
524288
Address Bus Width :
26
Base Part Number :
LPC1777
Peak Reflow Temperature (Cel) :
260
JESD-609 Code :
e3
Length :
28mm
Terminal Pitch :
0.5mm
Pin Count :
208
Supply Voltage-Max (Vsup) :
3.6V
Supply Voltage :
3.3V
Voltage - Supply (Vcc/Vdd) :
2.4V~3.6V
Peripherals :
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
CPU Family :
CORTEX-M3
Factory Lead Time :
12 Weeks
External Data Bus Width :
32
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PQFP-G208
HTS Code :
8542.31.00.01
Connectivity :
CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Terminal Position :
QUAD
Terminal Form :
Gull wing
Series :
LPC17xx
PWM Channels :
yes
Qualification Status :
Not Qualified
Power Supplies :
3.3V
Width :
28mm
Number of Terminations :
208
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Data Converter :
A/D 8x12b; D/A 1x10b
Operating Temperature :
-40°C~85°C TA
Height Seated (Max) :
1.6mm
ECCN Code :
EAR99
Supply Voltage-Min (Vsup) :
2.4V
Mounting Type :
Surface Mount
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
DMA Channels :
yes
Bit Size :
32
Number of I/O :
165
Program Memory Size :
512KB 512K x 8
EEPROM Size :
4K x 8
Speed :
120MHz
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
Package / Case :
208-LQFP
Surface Mount :
yes
Terminal Finish :
Tin (Sn)
Program Memory Type :
Flash
RAM Size :
96K x 8
Core Size :
32-Bit
Datasheets
LPC1777FBD208,551
Introducing Microcontrollers NXP Semiconductors LPC1777FBD208,551 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LPC1777, Number of Terminations:208, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:208-LQFP, LPC1777FBD208,551 pinout, LPC1777FBD208,551 datasheet PDF, LPC1777FBD208,551 amp .Beyond Microcontrollers NXP Semiconductors LPC1777FBD208,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC1777FBD208,551


Microcontrollers NXP Semiconductors LPC1777FBD208,551 Overview

The Microcontrollers NXP Semiconductors LPC1777FBD208,551 is a high-performance, 32-bit MCU designed to meet the advanced needs of embedded applications. Featuring 512KB of flash memory and packaged in a 208LQFP format, this microcontroller is optimized for both efficiency and flexibility. Its robust processing power is suitable for a broad range of industrial, communication, and automation tasks, making it a vital component for developers looking to push the boundaries of innovation and reliability in their products.

LPC1777FBD208,551 Features

This microcontroller boasts a comprehensive feature set that includes an ARM Cortex-M3 processor, which delivers exceptional speed and responsiveness. Additional features such as multiple serial communication interfaces, enhanced I/O port functionality, and low power consumption make the LPC1777FBD208,551 a versatile choice for integrating into sophisticated electronics systems. Its ability to support various digital and analog peripherals enhances its utility in complex embedded systems.

LPC1777FBD208,551 Applications

  • Industrial Automation: Integrates seamlessly into control systems for real-time process management and monitoring, enhancing operational efficiency and reliability.
  • Medical Devices: Used in medical monitoring systems to process complex datasets and support critical functions reliably and securely.
  • Automotive Applications: Suitable for automotive electronics, including in-vehicle infotainment and advanced driver-assistance systems (ADAS), where robust performance is required.
  • Communication Infrastructure: Acts as a core component in communication devices to handle data transmission and signal processing tasks efficiently.
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