LPC1769FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Package / Case :

100-LQFP

DMA Channels :

yes

Peak Reflow Temperature (Cel) :

260

Supply Voltage-Min (Vsup) :

2.4V

Power Supplies :

3.3V

Core Processor :

ARM® Cortex®-M3

Has ADC :

yes

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Data Converter :

A/D 8x12b; D/A 1x10b

Mounting Type :

Surface Mount

Number of I/O :

70

Program Memory Size :

512KB 512K x 8

Terminal Form :

Gull wing

Operating Temperature :

-40°C~85°C TA

Terminal Pitch :

0.5mm

Program Memory Type :

Flash

RAM Size :

64K x 8

Surface Mount :

yes

Factory Lead Time :

12 Weeks

Bit Size :

32

JESD-609 Code :

e3

Width :

14mm

Packaging :

Tray

RoHS Status :

ROHS3 Compliant

Base Part Number :

LPC1769

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ROM (words) :

524288

Terminal Position :

QUAD

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

3.6V

ECCN Code :

EAR99

Length :

14mm

PWM Channels :

yes

Qualification Status :

Not Qualified

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Published :

2007

JESD-30 Code :

S-PQFP-G100

Core Size :

32-Bit

Oscillator Type :

Internal

Pin Count :

100

Supply Voltage :

3.3V

Terminal Finish :

Tin (Sn)

Speed :

120MHz

Series :

LPC17xx

DAC Channels :

yes

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Height Seated (Max) :

1.6mm

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Number of Terminations :

100

Clock Frequency :

25MHz