LPC1768FET100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Supply Voltage :

3.3V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

12 Weeks

Package / Case :

100-TFBGA

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

0.8mm

Number of Terminations :

100

PWM Channels :

yes

DAC Channels :

yes

Supply Voltage-Min (Vsup) :

2.4V

Base Part Number :

LPC1768

Width :

9mm

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Series :

LPC17xx

Supply Voltage-Max (Vsup) :

3.6V

JESD-609 Code :

e1

Power Supplies :

3.3V

RAM Size :

64K x 8

DMA Channels :

yes

Peak Reflow Temperature (Cel) :

260

ROM (words) :

524288

Surface Mount :

yes

Qualification Status :

Not Qualified

Terminal Position :

BOTTOM

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of I/O :

70

Speed :

100MHz

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Height Seated (Max) :

1.2mm

Core Processor :

ARM® Cortex®-M3

Program Memory Size :

512KB 512K x 8

Bit Size :

32

ECCN Code :

EAR99

Oscillator Type :

Internal

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Clock Frequency :

25MHz

Published :

2009

Terminal Form :

Ball

CPU Family :

CORTEX-M3

Has ADC :

yes

Mounting Type :

Surface Mount

Data Converter :

A/D 8x12b; D/A 1x10b

Pin Count :

100

JESD-30 Code :

S-PBGA-B100

Program Memory Type :

Flash

HTS Code :

8542.31.00.01

Operating Temperature :

-40°C~85°C TA

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Length :

9mm

Core Size :

32-Bit