LFX200EB-04FN256I

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Mfr.Part #
LFX200EB-04FN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
9,847
In Stock :
9,847

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~105°C TJ
Height Seated (Max) :
2.1mm
Voltage - Supply :
2.3V~3.6V
Total RAM Bits :
113664
Number of Outputs :
160
RoHS Status :
RoHS Compliant
Mount :
Surface Mount
Pbfree Code :
yes
RAM Size :
13.9kB
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Number of CLBs :
676
Terminal Pitch :
1mm
Base Part Number :
LFX200
Lead Free :
Lead Free
Number of Terminations :
256
Additional Feature :
ALSO OPERATES WITH 3.3V SUPPLY
Width :
17mm
Supply Voltage :
2.5V
Operating Supply Voltage :
2.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency :
320MHz
Number of Pins :
256
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
EAR99
Number of Logic Elements/Cells :
2704
JESD-609 Code :
e1
Memory Size :
19.3kB
Qualification Status :
Not Qualified
Published :
2000
Combinatorial Delay of a CLB-Max :
0.93 ns
Length :
17mm
Mounting Type :
Surface Mount
Packaging :
Tray
Power Supplies :
2.5/3.3V
Number of Gates :
210000
Number of I/O :
160
Terminal Position :
BOTTOM
Package / Case :
256-BGA
Pin Count :
256
Series :
ispXPGA®
Datasheets
LFX200EB-04FN256I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-04FN256I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~105°C TJ, Base Part Number:LFX200, Number of Terminations:256, Number of Pins:256, Mounting Type:Surface Mount, Package / Case:256-BGA, LFX200EB-04FN256I pinout, LFX200EB-04FN256I datasheet PDF, LFX200EB-04FN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-04FN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFX200EB-04FN256I


FPGAs Lattice Semiconductor LFX200EB-04FN256I Overview

The FPGAs Lattice Semiconductor LFX200EB-04FN256I represents a cutting-edge solution in the world of programmable logic devices. Designed by Lattice Semiconductor, this FPGA (Field Programmable Gate Array) is tailored for high-performance applications that require versatile and rapid deployment capabilities. The LFX200EB-04FN256I is built on a robust 256FBGA package, making it highly suitable for compact yet demanding environments. With its ability to handle 160 I/O ports, this FPGA provides ample flexibility for various complex digital circuits, enhancing system reliability and performance in critical applications.

LFX200EB-04FN256I Features

This model features a substantial array of input/output options that facilitate a broad range of functionality, supporting advanced digital processing needs. It is particularly designed for scalability and efficiency, ensuring that users can leverage its capabilities for both prototyping and mass production scenarios. The 256FBGA packaging not only enhances the thermal management but also aids in reducing the overall footprint, making it ideal for space-constrained applications.

LFX200EB-04FN256I Applications

  • Telecommunications: The LFX200EB-04FN256I can be integrated into telecommunications infrastructure, such as switches and routers, to enhance signal processing capabilities and support high-speed data transmission.
  • Consumer Electronics: Employed in devices like high-definition televisions and gaming consoles, this FPGA helps in delivering intensive graphical outputs and real-time processing without lags.
  • Automotive Systems: In automotive applications, this FPGA is used for managing advanced driver-assistance systems (ADAS), providing robust processing power required for sensor data integration and real-time decision making.
  • Industrial Automation: The robust I/O capabilities make it ideal for control systems in industrial automation, improving operational efficiency and machine-to-machine communication.
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