LFX200EB-03F256C
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- Mfr.Part #
- LFX200EB-03F256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 9,352
- In Stock ：
- 9,352
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Lead Free :
- Lead Free
- RAM Size :
- 13.9kB
- Number of Outputs :
- 160
- Clock Frequency :
- 320MHz
- Width :
- 17mm
- Pin Count :
- 256
- Power Supplies :
- 2.5/3.3V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Total RAM Bits :
- 113664
- Published :
- 2000
- Combinatorial Delay of a CLB-Max :
- 1.07 ns
- Number of Logic Elements/Cells :
- 2704
- Qualification Status :
- Not Qualified
- Base Part Number :
- LFX200
- Package / Case :
- 256-BGA
- Mount :
- Surface Mount
- Number of CLBs :
- 676
- Voltage - Supply :
- 2.3V~3.6V
- Operating Supply Voltage :
- 2.5V
- Series :
- ispXPGA®
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 2.5V
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 256
- Number of Pins :
- 256
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tray
- Terminal Form :
- Ball
- Additional Feature :
- ALSO OPERATES WITH 3.3V SUPPLY
- Number of Gates :
- 210000
- ECCN Code :
- EAR99
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 225
- Memory Size :
- 19.3kB
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 2.1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 160
- Length :
- 17mm
- Datasheets
- LFX200EB-03F256C
FPGAs Lattice Semiconductor LFX200EB-03F256C Overview
The LFX200EB-03F256C, a leading-edge FPGA from Lattice Semiconductor, is designed to meet the evolving demands of modern technology sectors. This FPGA combines versatility with performance, encapsulated in a compact 256FBGA package, making it ideal for sophisticated yet space-conscious applications. The integration of 160 I/O allows for robust connectivity options, enhancing system integration and scalability. Optimized for low-power consumption while maintaining high performance, the FPGAs Lattice Semiconductor LFX200EB-03F256C is the solution of choice for developers looking to push the boundaries of innovation in hardware design.
LFX200EB-03F256C Features
This FPGA model boasts a variety of features that cater to the needs of high-performance computing environments requiring reliable and flexible solutions. Key features include a dense 256-ball fine-pitch BGA package that supports a large number of I/O interfaces and a programmable fabric that allows for custom configurations tailored to specific application needs. The device's low-power architecture ensures efficient operation, reducing the overall energy cost and heat generation, making it suitable for energy-sensitive projects.
LFX200EB-03F256C Applications
- Consumer Electronics: Used in smart home devices, gaming consoles, and wearable technology, where its ability to handle multiple inputs and outputs efficiently enhances user experience and functionality.
- Industrial Automation: Integrated in systems requiring high levels of data processing and real-time execution such as robotics and assembly line sensors, improving operational efficiency and reliability.
- Automotive Applications: Ideal for advanced driver-assistance systems (ADAS) and infotainment systems, providing the necessary processing power and connectivity to support real-time decision-making and multimedia processing.
- Telecommunications: Employs in network infrastructure to facilitate high-speed data transmission and signal processing tasks, supporting the expansion of 5G and other advanced communication technologies.
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