LFX200EB-03FN256I

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Mfr.Part #
LFX200EB-03FN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
812
In Stock :
812

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
256-BGA
Number of Pins :
256
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
1.07 ns
Packaging :
Tray
Operating Supply Voltage :
2.5V
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of CLBs :
676
Published :
2000
Terminal Form :
Ball
Width :
17mm
Number of Terminations :
256
Pin Count :
256
Mount :
Surface Mount
JESD-609 Code :
e1
Base Part Number :
LFX200
Additional Feature :
ALSO OPERATES WITH 3.3V SUPPLY
Pbfree Code :
yes
HTS Code :
8542.39.00.01
RAM Size :
13.9kB
Mounting Type :
Surface Mount
Qualification Status :
Not Qualified
Number of Outputs :
160
ECCN Code :
EAR99
Memory Size :
19.3kB
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Total RAM Bits :
113664
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
17mm
Supply Voltage :
2.5V
Operating Temperature :
-40°C~105°C TJ
Series :
ispXPGA®
Voltage - Supply :
2.3V~3.6V
Power Supplies :
2.5/3.3V
RoHS Status :
RoHS Compliant
Height Seated (Max) :
2.1mm
Clock Frequency :
320MHz
Number of I/O :
160
Number of Logic Elements/Cells :
2704
Terminal Position :
BOTTOM
Number of Gates :
210000
Datasheets
LFX200EB-03FN256I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-03FN256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Number of Pins:256, Number of Terminations:256, Base Part Number:LFX200, Mounting Type:Surface Mount, Operating Temperature:-40°C~105°C TJ, LFX200EB-03FN256I pinout, LFX200EB-03FN256I datasheet PDF, LFX200EB-03FN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFX200EB-03FN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFX200EB-03FN256I


FPGAs Lattice Semiconductor LFX200EB-03FN256I Overview

Introducing the LFX200EB-03FN256I from Lattice Semiconductor, a state-of-the-art FPGA designed to cater to the demanding needs of modern technology applications. This device encapsulates robust performance in a compact 256FBGA package, making it an ideal solution for designers seeking high functionality with minimal footprint. With its extensive I/O capability of 160 pins, the LFX200EB-03FN256I offers unparalleled flexibility and connectivity, enabling complex and versatile circuit designs. This product is specifically crafted to enhance efficiency and reliability in various high-tech environments, embodying the cutting-edge of FPGA technology. The incorporation of the keyword [FPGAs Lattice Semiconductor LFX200EB-03FN256I] underscores its identity as a top-tier component in its category, ensuring it stands out in the competitive tech landscape.

LFX200EB-03FN256I Features

The LFX200EB-03FN256I FPGA boasts a comprehensive set of features that enhance its appeal to a broad spectrum of technological applications. Key features include a high-density 256-ball fine pitch BGA package, which allows for a more compact and efficient design. With 160 I/O options, it supports a wide array of connectivity configurations. Additionally, the device is designed for extended temperature operation, ensuring reliability and performance under extreme conditions. It also supports numerous logic configuration possibilities, which can be tailored to meet specific project requirements, adding to its flexibility and utility.

LFX200EB-03FN256I Applications

  • Automotive Electronics: Used in vehicle infotainment systems and advanced driver-assistance systems (ADAS) to manage multiple inputs and outputs while ensuring reliable operation in extreme conditions.
  • Consumer Electronics: Integrates into smart home devices, providing the processing power needed for complex control systems and connectivity options.
  • Industrial Automation: Employs in control systems for manufacturing lines, enhancing automation capabilities with its extensive I/O flexibility and robust performance.
  • Telecommunications: Serves as a critical component in the infrastructure of 5G networks, facilitating rapid data processing and transmission capabilities essential for modern telecommunications.
  • Medical Devices: Utilized in medical imaging systems, where high data throughput and precise control are necessary for effective diagnostics.
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