LFE2M70SE-7FN900C
- Mfr.Part #
- LFE2M70SE-7FN900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 40,588
- In Stock :
- 40,588
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 900
- Operating Supply Voltage :
- 1.2V
- Memory Size :
- 584.9kB
- JESD-609 Code :
- e1
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 416
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Number of Logic Cells :
- 70000
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Logic Elements/Cells :
- 67000
- Lead Free :
- Lead Free
- Pin Count :
- 900
- Combinatorial Delay of a CLB-Max :
- 0.304 ns
- Clock Frequency :
- 420MHz
- Length :
- 31mm
- Height Seated (Max) :
- 2.6mm
- Base Part Number :
- LFE2M70
- Mount :
- Surface Mount
- Width :
- 31mm
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 8375
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 416
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Number of Pins :
- 900
- Terminal Position :
- BOTTOM
- Series :
- ECP2M
- Operating Temperature :
- 0°C~85°C TJ
- Factory Lead Time :
- 8 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RAM Size :
- 566.8kB
- Package / Case :
- 900-BBGA
- Peak Reflow Temperature (Cel) :
- 250
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 4642816
- Published :
- 2012
- Datasheets
- LFE2M70SE-7FN900C

FPGAs Lattice Semiconductor LFE2M70SE-7FN900C Overview
Introducing the FPGAs Lattice Semiconductor LFE2M70SE-7FN900C, a high-performance field-programmable gate array (FPGA) designed for advanced system-level applications. This device from Lattice Semiconductor provides a versatile platform suitable for integrating multiple functionalities in a single system. The LFE2M70SE-7FN900C is engineered to meet the demands of high-throughput systems, featuring a robust 900FBGA package and a substantial number of I/O options. This FPGA excels in environments requiring high-speed data processing and high reliability, making it an ideal choice for developers looking to push the boundaries of technology with innovative product designs.
LFE2M70SE-7FN900C Features
The LFE2M70SE-7FN900C is equipped with 416 I/O pins, allowing extensive connectivity and interface options. Its 900FBGA packaging ensures a compact footprint while providing the scalability needed for complex circuit designs. This FPGA is built to offer high performance with lower power consumption, which is essential for sustainable and efficient operation in a wide range of applications.
LFE2M70SE-7FN900C Applications
- Telecommunications Infrastructure: Utilized in base stations and network routers for signal processing and data flow management, enhancing network efficiency and reliability.
- Automotive Electronics: Integrated into driver assistance systems to process real-time sensory data, contributing to safer driving experiences and vehicle automation.
- Industrial Automation: Employed in control systems for machinery and production lines, optimizing operations through improved process control and automation capabilities.
- Consumer Electronics: Serves as the core processing unit in high-performance gaming consoles and home entertainment systems, delivering enhanced graphics and user interface responsiveness.
- Medical Devices: Used in diagnostic and imaging equipment, helping to handle complex computations for better accuracy and faster patient results.
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