LFE2M100E-6F900C
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- Mfr.Part #
- LFE2M100E-6F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 49,105
- In Stock ：
- 49,105
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Max Frequency :
- 357MHz
- Memory Size :
- 688.8kB
- Number of Outputs :
- 416
- Peak Reflow Temperature (Cel) :
- 225
- Package / Case :
- 900-BBGA
- Number of Pins :
- 900
- Number of I/O :
- 416
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Series :
- ECP2M
- Height Seated (Max) :
- 2.6mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Reach Compliance Code :
- not_compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 11875
- RAM Size :
- 663.5kB
- Voltage - Supply :
- 1.14V~1.26V
- Lead Free :
- Lead Free
- Length :
- 31mm
- Number of Logic Elements/Cells :
- 95000
- Number of Logic Cells :
- 100000
- Base Part Number :
- LFE2M100
- Supply Voltage :
- 1.2V
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 5435392
- Operating Supply Voltage :
- 1.2V
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Number of Terminations :
- 900
- Pbfree Code :
- No
- Pin Count :
- 900
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Published :
- 2012
- Width :
- 31mm
- Datasheets
- LFE2M100E-6F900C
FPGAs Lattice Semiconductor LFE2M100E-6F900C Overview
The FPGAs Lattice Semiconductor LFE2M100E-6F900C represents a high-performance FPGA (Field Programmable Gate Array) solution designed to meet the increasing demands of modern embedded systems. Manufactured by Lattice Semiconductor, this IC FPGA offers exceptional integration capabilities within a 900FBGA package, making it an ideal choice for applications requiring high I/O bandwidth and extensive programmability. Its ability to support complex digital systems while maintaining a compact and energy-efficient footprint allows designers to create more robust and adaptable products. By leveraging advanced technology, the LFE2M100E-6F900C enhances system performance with its versatile configuration options, tailored to address the rigorous requirements of high-speed data processing and complex algorithm implementations.
LFE2M100E-6F900C Features
The LFE2M100E-6F900C is equipped with 416 I/O pins, providing ample connectivity for diverse applications. Its 900FBGA packaging ensures a minimal footprint on the system board, optimizing board space without compromising performance. This FPGA is capable of facilitating complex, multi-functional designs due to its robust programmable logic capability, which allows for customization post-manufacturing, adding invaluable flexibility to product design cycles.
LFE2M100E-6F900C Applications
- Telecommunications: Utilized in communication infrastructure, the LFE2M100E-6F900C manages signal processing and data flow efficiently, ensuring reliable and fast communications.
- Industrial Automation: This FPGA is crucial in automating processes in manufacturing environments, where precision and adaptability to new protocols are key.
- Consumer Electronics: Implemented in devices such as smartphones and tablets, the LFE2M100E-6F900C supports sophisticated user interfaces and high-speed data processing to enhance user experience.
- Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to provide real-time responses, thereby increasing vehicle safety and functionality.
- Medical Devices: In medical imaging systems, it processes complex algorithms necessary for high-resolution imaging techniques, improving diagnostic capabilities.
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