LFE2-70E-6F672I
- Mfr.Part #
- LFE2-70E-6F672I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 672FPBGA
- Stock
- 8,548
- In Stock :
- 8,548
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Base Part Number :
- LFE2-70
- Number of Logic Elements/Cells :
- 68000
- Pin Count :
- 672
- Packaging :
- Tray
- Total RAM Bits :
- 1056768
- Number of Terminations :
- 672
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- Non-RoHS Compliant
- Lead Free :
- Lead Free
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 129kB
- Pbfree Code :
- No
- Operating Supply Voltage :
- 1.2V
- Length :
- 27mm
- Number of LABs/CLBs :
- 8500
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Pins :
- 672
- Max Frequency :
- 357MHz
- Terminal Position :
- BOTTOM
- Number of Logic Cells :
- 70000
- Package / Case :
- 672-BBGA
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- 225
- Height Seated (Max) :
- 2.6mm
- Memory Size :
- 146kB
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Width :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Series :
- ECP2
- Published :
- 2012
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Outputs :
- 500
- Number of I/O :
- 500
- Datasheets
- LFE2-70E-6F672I

FPGAs Lattice Semiconductor LFE2-70E-6F672I Overview
The LFE2-70E-6F672I from Lattice Semiconductor represents a state-of-the-art Field Programmable Gate Array (FPGA), offering a high-density, versatile solution designed for the demanding needs of modern digital applications. This product is engineered to support a vast array of functionalities while maintaining low power consumption and high reliability. The 672-pin fine-pitch Ball Grid Array (FPBGA) package ensures compact integration and robust connectivity. This FPGA is an ideal choice for developers looking for a scalable solution that can meet both current and future system requirements, making it a pivotal component in advanced electronics design.
LFE2-70E-6F672I Features
- 500 user I/Os for flexible connectivity and integration options
- 672FPBGA packaging for efficient space utilization and enhanced thermal management
- Low-power operation, suitable for power-sensitive applications
- High configurability, facilitating a wide range of application uses
LFE2-70E-6F672I Applications
- Telecommunications Infrastructure: Utilized in routers and switches to manage data flow efficiently and reliably.
- Automotive Electronics: Employed in driver assistance systems to process real-time sensory data and enhance vehicle safety.
- Industrial Automation: Integral in controlling machinery and process lines, enhancing operational reliability and precision.
- Consumer Electronics: Applied in smart home devices, providing flexible control and connectivity options for a wide range of products.
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