IS61VPD102418A-200B3I
- Mfr.Part #
- IS61VPD102418A-200B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165PBGA
- Stock
- 9,307
- In Stock :
- 9,307
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Terminal Position :
- BOTTOM
- I/O Type :
- COMMON
- Memory Interface :
- Parallel
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Supply Current-Max :
- 0.475mA
- JESD-609 Code :
- e0
- Pbfree Code :
- No
- Mounting Type :
- Surface Mount
- Standby Voltage-Min :
- 2.38V
- Voltage - Supply :
- 2.375V~2.625V
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 2.5V
- Number of Terminations :
- 165
- Memory Format :
- SRAM
- Power Supplies :
- 2.5V
- Supply Voltage-Min (Vsup) :
- 2.375V
- Memory Width :
- 18
- Additional Feature :
- PIPELINED ARCHITECTURE
- Packaging :
- Tray
- HTS Code :
- 8542.32.00.41
- Length :
- 15mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Density :
- 18874368 bit
- Package / Case :
- 165-TBGA
- Surface Mount :
- yes
- Memory Size :
- 18Mb 1M x 18
- Operating Temperature :
- -40°C~85°C TA
- Standby Current-Max :
- 0.075A
- Width :
- 13mm
- Height Seated (Max) :
- 1.2mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Functions :
- 1
- Clock Frequency :
- 200MHz
- Supply Voltage-Max (Vsup) :
- 2.625V
- Output Characteristics :
- 3-STATE
- Pin Count :
- 165
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Organization :
- 1MX18
- Memory Type :
- Volatile
- Access Time :
- 3.1ns
- Number of Pins :
- 165
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- ECCN Code :
- 3A991.B.2.A
- Datasheets
- IS61VPD102418A-200B3I

Memory Integrated Silicon Solution, Inc. (ISSI) IS61VPD102418A-200B3I Overview
The IS61VPD102418A-200B3I, crafted by Integrated Silicon Solution, Inc. (ISSI), is a high-performance 18Mbit SRAM component engineered to meet the increasing demands for faster and reliable memory in the tech industry. This SRAM module offers a parallel interface and comes packaged in a compact 165PBGA format, making it an ideal choice for applications requiring high speed, low latency, and flexibility in memory management. The integration of such Memory Integrated Silicon Solution, Inc. (ISSI) components ensures enhanced system reliability and improved performance in critical applications, making it a cornerstone in the development of advanced electronic systems.
IS61VPD102418A-200B3I Features
This memory module boasts a number of features designed for robust, high-speed operations including a large 18Mbit storage capacity and a fast access time, housed in a practical 165PBGA package. Its parallel interface facilitates quicker data transfer rates, which is essential for high-performance computing and real-time applications. Moreover, the product's durability and design are tailored to withstand the rigors of intensive use, ensuring reliability across various environmental conditions.
IS61VPD102418A-200B3I Applications
- Networking Equipment: Utilized in routers and switches for packet buffering, ensuring efficient data flow and reduced latency in network communications.
- Telecommunications Systems: Plays a critical role in data storage for telecommunications infrastructure, supporting fast access to data and reliability in communication technologies.
- Automotive Electronics: Essential for advanced driver-assistance systems (ADAS), where quick access to data can significantly impact system performance and safety.
- Industrial Automation: Helps in managing complex processes and machinery with precise control and reliability, vital for maintaining high productivity and operational safety in industrial settings.
- Consumer Electronics: Used in devices such as high-performance gaming consoles and smart TVs, enhancing user experience through improved speed and responsiveness of the device.
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