IS61LF102418A-7.5B3

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Mfr.Part #
IS61LF102418A-7.5B3
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
11,356
In Stock :
11,356

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Format :
SRAM
Output Characteristics :
3-STATE
Pbfree Code :
No
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
Packaging :
Tray
Standby Voltage-Min :
3.14V
Number of Terminations :
165
Supply Voltage-Max (Vsup) :
3.465V
Organization :
1MX18
HTS Code :
8542.32.00.41
Height Seated (Max) :
1.2mm
Memory Density :
18874368 bit
Clock Frequency :
117MHz
Supply Voltage :
3.3V
Memory Type :
Volatile
Memory Width :
18
Qualification Status :
Not Qualified
Length :
15mm
I/O Type :
COMMON
Number of Functions :
1
Standby Current-Max :
0.075A
Terminal Finish :
Tin/Lead (Sn/Pb)
Supply Voltage-Min (Vsup) :
3.135V
JESD-609 Code :
e0
ECCN Code :
3A991.B.2.A
Operating Temperature :
-40°C~85°C TA
Package / Case :
165-TBGA
Width :
13mm
Voltage - Supply :
3.135V~3.465V
Power Supplies :
2.5/3.33.3V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Position :
BOTTOM
RoHS Status :
ROHS3 Compliant
Access Time :
7.5ns
Pin Count :
165
Additional Feature :
PIPELINED ARCHITECTURE, FLOW-THROUGH
Surface Mount :
yes
Memory Interface :
Parallel
Supply Current-Max :
0.25mA
Number of Pins :
165
Memory Size :
18Mb 1M x 18
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-7.5B3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:165, Operating Temperature:-40°C~85°C TA, Package / Case:165-TBGA, Number of Pins:165, IS61LF102418A-7.5B3 pinout, IS61LF102418A-7.5B3 datasheet PDF, IS61LF102418A-7.5B3 amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-7.5B3 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-7.5B3


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-7.5B3 Overview

The IS61LF102418A-7.5B3 by Integrated Silicon Solution, Inc. (ISSI) is a cutting-edge SRAM (Static Random Access Memory) component designed for high-speed and high-capacity memory requirements. With an impressive 18Mbit capacity and a compact 165TFBGA (Thin Fine Pitch Ball Grid Array) package, this SRAM module is engineered to deliver reliable, rapid data access and storage. It stands out in the Memory category for its advanced technology and robust performance, making it a prime choice for businesses looking to enhance their electronic systems. The integration of such a Memory component ensures efficiency and durability in demanding applications, fostering advancements in electronic design and functionality.

IS61LF102418A-7.5B3 Features

This SRAM device boasts a parallel interface, allowing for quick data transfer rates and seamless integration into existing architectures. Its 7.5 ns access time is tailored for applications requiring high-speed memory access, enhancing overall system responsiveness. The 165TFBGA package not only minimizes the footprint on circuit boards but also aids in better thermal management, thus improving the reliability and longevity of the device under varying operational conditions.

IS61LF102418A-7.5B3 Applications

  • Telecommunications Equipment: Utilized in routers and switches, the IS61LF102418A-7.5B3 provides the necessary speed and capacity for handling high volumes of data traffic efficiently.
  • Automotive Electronics: Supports advanced automotive systems such as infotainment units and driver assistance systems, where quick data retrieval is crucial.
  • Industrial Automation: Ideal for use in PLCs (Programmable Logic Controllers) and other automation technologies, enhancing process control and machine-to-machine communication.
  • Medical Devices: Employs in critical medical imaging equipment, ensuring rapid access to data, crucial for real-time monitoring and diagnostics.
  • Consumer Electronics: Applied in high-performance gaming consoles and smart home devices, where enhanced memory capacity and speed improve user experience and functionality.
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