IS61LF102418A-6.5B3
- Mfr.Part #
- IS61LF102418A-6.5B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 22,841
- In Stock :
- 22,841
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Number of Functions :
- 1
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Format :
- SRAM
- Additional Feature :
- PIPELINED ARCHITECTURE, FLOW-THROUGH
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Word Size :
- 18b
- Pin Count :
- 165
- Length :
- 15mm
- I/O Type :
- COMMON
- Standby Current-Max :
- 0.06A
- Mounting Type :
- Surface Mount
- Package / Case :
- 165-TBGA
- Organization :
- 1MX18
- JESD-609 Code :
- e0
- Standby Voltage-Min :
- 3.14V
- Voltage - Supply :
- 3.135V~3.465V
- Packaging :
- Tray
- Memory Interface :
- Parallel
- Density :
- 18 Mb
- Memory Size :
- 18Mb 1M x 18
- Access Time :
- 6.5ns
- Nominal Supply Current :
- 250mA
- Address Bus Width :
- 20b
- Number of Pins :
- 165
- Sync/Async :
- SYNCHRONOUS
- Supply Voltage-Max (Vsup) :
- 3.465V
- Operating Supply Voltage :
- 3.3V
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 3.3V
- Supply Voltage-Min (Vsup) :
- 3.135V
- Clock Frequency :
- 133MHz
- Number of Terminations :
- 165
- Number of Ports :
- 2
- Terminal Pitch :
- 1mm
- Output Characteristics :
- 3-STATE
- Surface Mount :
- yes
- Memory Type :
- Volatile
- Operating Temperature :
- 0°C~70°C TA
- RoHS Status :
- ROHS3 Compliant
- Memory Width :
- 18
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Pbfree Code :
- No
- Datasheets
- IS61LF102418A-6.5B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LF102418A-6.5B3 Overview
The IS61LF102418A-6.5B3 by Integrated Silicon Solution, Inc. (ISSI) stands as a pivotal component in the arena of advanced Memory technology. This high-capacity SRAM device boasts an impressive 18Mbit storage capacity, crafted meticulously in a compact 165TFBGA package. Designed for high-speed applications requiring quick access and stable storage, this SRAM module offers exceptional reliability and performance. Its robust design and cutting-edge technology make it an ideal choice for applications demanding high-speed data buffering and temporary data storage. The integration of such advanced memory solutions enables enhanced system performance and efficiency, making it a preferred choice for B2B customers aiming to leverage high-performance computing in their products.
IS61LF102418A-6.5B3 Features
The IS61LF102418A-6.5B3 memory chip is optimized for seamless integration and superior performance in critical applications. Key features include a large 18Mbit capacity, a fast access time of 6.5ns, and a parallel interface for straightforward connectivity. Engineered in a highly efficient 165TFBGA package, it ensures minimized space usage while maximizing reliability and thermal stability, essential for maintaining integrity and performance in high-demand environments.
IS61LF102418A-6.5B3 Applications
- Networking Equipment: Utilized for fast data buffering in routers, switches, and other networking hardware to enhance processing speed and handle high-volume information flows efficiently.
- Telecommunications Infrastructure: Supports the demands of telecommunications systems for quick access and processing of information, crucial for real-time communication applications.
- High-Performance Computing (HPC): Critical in scenarios requiring rapid access to large data sets, such as in scientific research, simulations, and data analysis.
- Industrial Automation: Facilitates the operation of complex machinery and control systems by providing fast, reliable data access, essential for maintaining high precision and operational efficiency.
- Automotive Electronics: Enhances the functionality and reliability of automotive systems, including advanced driver-assistance systems (ADAS), by enabling quicker data processing and storage.
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