IS43TR16512S2DL-125KBL

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Mfr.Part #
IS43TR16512S2DL-125KBL
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
96-LFBGA
Datasheet
Download
Description
IC DRAM 8GBIT PARALLEL 96LWBGA
Stock
19,037
In Stock :
19,037

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Series :
Automotive, AEC-Q100
Base Product Number :
IS43TR16512
Memory Organization :
512M x 16
Product Status :
Active
Address Bus Width :
15 bit
Density :
8 Gbit
Number of I/O Lines :
16 bit
Operating Supply Voltage :
1.35 V
Mounting :
Surface Mount
Manufacturer :
ISSI
Minimum Operating Temperature :
0 C
Memory Type :
Volatile
Number of Banks :
8
Supplier Package :
BGA
Memory Size :
8Gbit
Technology :
SDRAM - DDR3L
Organization :
512M x 16
Memory Interface :
Parallel
Mounting Style :
SMD/SMT
Package :
Tray
Pin Count :
96
Memory Format :
DRAM
Product Type :
DRAM
Maximum Operating Temperature :
+ 95 C
Operating Temperature :
0 to 95 °C
Clock Frequency :
800 MHz
Product Category :
DRAM
Supplier Device Package :
96-LWBGA (9x13)
Subcategory :
Memory and Data Storage
Brand :
ISSI
Mounting Type :
Surface Mount
Screening Level :
COMMERCIAL
Voltage - Supply :
1.283V ~ 1.45V
Type :
DDR3 SDRAM
Maximum Clock Rate :
800 MHz
Package / Case :
96-LFBGA
Write Cycle Time - Word, Page :
15ns
Access Time :
20 ns
Data Bus Width :
16 bit
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS43TR16512S2DL-125KBL from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0 to 95 °C, Mounting Type:Surface Mount, Type:DDR3 SDRAM, Package / Case:96-LFBGA, IS43TR16512S2DL-125KBL pinout, IS43TR16512S2DL-125KBL datasheet PDF, IS43TR16512S2DL-125KBL amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS43TR16512S2DL-125KBL ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS43TR16512S2DL-125KBL


Memory Integrated Silicon Solution, Inc. (ISSI) IS43TR16512S2DL-125KBL Overview

The IS43TR16512S2DL-125KBL from Integrated Silicon Solution, Inc. (ISSI) is a cutting-edge DRAM IC that offers a substantial storage capacity of

Memory Integrated Silicon Solution, Inc. (ISSI) IS438TR16512S2DL-125KBL Overview

The Memory Integrated Silicon Solution, Inc. (ISSI)bit IS43TR16512S2DL-125K,BL is a high-capacity, dynamic random-access memory (DRAM) integrated tailored circuit, designed to meet the rigorous demands of high-performance for high-performance computing computing systems. This 8 Gbit DR applications. This memoryAM module component is, implemented encased in in a a compact compact 9696-ballL lowWB-profileGA B packageGA, ( isL specificallyWBGA designed) to package meet, the rigorous which ensures minimal footprint demands of modern digital on systems the system board. The Memory while Integrated providing Silicon robust Solution reliability and performance. Catering, Inc. (ISSI) specifically to IS sophisticated43 electronic environmentsTR,16512 this componentS2 offersDL an-125KBL ideal solution for developers exempl lookingifies to reliability enhance and system efficiency capabilities, with making increased it memory bandwidth an ideal and storage capacity choice for manufacturers.

whileIS43 maintaining energyTR16512 efficiency and reducingS latency2. 125 FeaturesIS 12The2 ISDL43-TR125165K12BLS Features2 This memory DR moduleAM from IC ISS boastsI a features parallel a interface parallel, interface ensuring, rapid facilitating data rapid transfer data transfer rates that rates that are essential for high are-speed essential computing tasks. The for 96 high-speedL computing tasks. The deviceWB operatesGA with a package standard is voltage not and only timing space conditions-efficient, optimizing but also both offers power enhanced thermal characteristics efficiency and performance, consistency which. Its are crucial for96 maintaining-ball configuration is stability and performance in dense engineered electronic for streamlined integration assemblies into. The chip a's wide range of design electronic is optimized assemblies for, ensuring low power consumption, contributing to the overall energy efficiency of compatibility and ease of the design across various platforms.

IS43TR which it is employed165. 2

IS43TR16512S2DL-125KBL Applications

  • Server Memory: Utilized in server farms to expand memory density, enabling more efficient data processing and management in cloud computing environments.
  • High-Performance Computing (HPC): Ideal for scientific and financial analysis applications where large data sets require rapid access and processing speeds.
  • Gaming ConsolesDL-125KBL Applications
    :Advanced Computing Systems: Utilized instrong server farms and data centers, this DRAM module significantly increases processing speed> and multi-tasking capabilities, essential for managing large-scale data Enh processing and complex computations. Telecommunication Infrastructure: Supports gaming the high-speed, high-volume data handling required in modern telecom networks experiences, enhancing the performance of switches, routers, and by other network backbone equipment.
  • providingAutomotive Electronics:
  • Networking Equipment: Used in routers and switches to handle the increasing data throughput needed for modern networking demands.
  • Telecommunications Infrastructure: Supports the data rate requirements of 5G networks and other high-speed telecommunications systems.
strong> Employs in advanced driver-assistance systems (ADAS) and infotainment systems, providing the necessary memory capacity and speed for real-time processing and responsiveness.
  • Industrial Automation: This DRAM is integral in complex automation systems for tasks such as real-time process control and machine vision, facilitating enhanced operational efficiency and reliability.
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    Shipping Method

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    Shipping Cost

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    The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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