IS43DR86400D-3DBLI
- Mfr.Part #
- IS43DR86400D-3DBLI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PARALLEL 60TWBGA
- Stock
- 10
- In Stock :
- 10
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 60
- Supply Voltage-Max (Vsup) :
- 1.9V
- Package / Case :
- 60-TFBGA
- Address Bus Width :
- 14b
- HTS Code :
- 8542.32.00.28
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 60
- Supply Voltage-Min (Vsup) :
- 1.7V
- Write Cycle Time - Word, Page :
- 15ns
- Operating Mode :
- SYNCHRONOUS
- Density :
- 512 Mb
- Qualification Status :
- Not Qualified
- I/O Type :
- COMMON
- Organization :
- 64MX8
- Additional Feature :
- PROGRAMMABLE CAS LATENCY
- JESD-609 Code :
- e1
- Standby Current-Max :
- 0.025A
- Interleaved Burst Length :
- 48
- Memory Interface :
- Parallel
- Height Seated (Max) :
- 1.2mm
- Memory Format :
- DRAM
- Terminal Pitch :
- 0.8mm
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Sequential Burst Length :
- 48
- Surface Mount :
- yes
- Operating Temperature :
- -40°C~85°C TA
- Clock Frequency :
- 333MHz
- Refresh Cycles :
- 8192
- Memory Size :
- 512Mb 64M x 8
- Memory Type :
- Volatile
- Length :
- 10.5mm
- Supply Current-Max :
- 0.23mA
- Memory Width :
- 8
- Number of Functions :
- 1
- ECCN Code :
- EAR99
- Access Time :
- 450ps
- Number of Ports :
- 1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Output Characteristics :
- 3-STATE
- Factory Lead Time :
- 8 Weeks
- Supply Voltage :
- 1.8V
- Terminal Position :
- BOTTOM
- Terminal Finish :
- TIN SILVER COPPER
- Operating Supply Voltage :
- 1.8V
- Voltage - Supply :
- 1.7V~1.9V
- Datasheets
- IS43DR86400D-3DBLI
IS43DR86400D-3DBLI Documents
Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR86400D-3DBLI Overview
The IS43DR86400D-3DBLI by Integrated Silicon Solution, Inc. (ISSI) represents a robust 512Mbit DRAM IC designed for high-speed, high-density memory requirements in advanced computing and digital applications. Engineered in a compact 60-ball TFBGA package, this memory module is optimized for reliability and performance. Leveraging advanced circuit design and manufacturing techniques, the Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR86400D-3DBLI ensures minimal power consumption while providing rapid parallel interface speeds, making it an ideal solution for businesses seeking efficient and scalable memory solutions.
IS43DR86400D-3DBLI Features
The IS43DR86400D-3DBLI offers a variety of features that enhance its suitability for intensive applications, including a parallel interface for swift data transfer, a substantial 512Mbit capacity for high-volume storage needs, and a space-saving 60-ball TFBGA package. It supports a wide range of industrial temperatures, ensuring reliable performance under varying environmental conditions.
IS43DR86400D-3DBLI Applications
- Advanced Computing Systems: Integrates seamlessly into server banks and high-performance computers, providing the necessary speed and capacity for intensive data processing tasks.
- Networking Hardware: Serves as a crucial component in routers and switches, facilitating rapid data buffering and transfer speeds essential for maintaining network efficiency.
- Telecommunications Equipment: Used in telecommunications infrastructure to ensure fast and reliable data access and storage, critical for real-time communication applications.
- Automotive Electronics: Enhances functionality in automotive systems requiring high-speed data retention for advanced driver-assistance systems (ADAS).
- Consumer Electronics: Ideal for use in high-end gaming consoles and home entertainment systems, where large amounts of fast-access memory are necessary for optimal performance.
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