IS43DR86400C-3DBLI
- Mfr.Part #
- IS43DR86400C-3DBLI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 512MBIT PARALLEL 60TWBGA
- Stock
- 5
- In Stock :
- 5
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- I/O Type :
- COMMON
- Height Seated (Max) :
- 1.2mm
- Operating Temperature :
- -40°C~85°C TA
- Organization :
- 64MX8
- Radiation Hardening :
- No
- Factory Lead Time :
- 8 Weeks
- Sequential Burst Length :
- 48
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 333MHz
- Package / Case :
- 60-TFBGA
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 10.5mm
- Output Characteristics :
- 3-STATE
- Address Bus Width :
- 16b
- Number of Functions :
- 1
- Number of Terminations :
- 60
- JESD-609 Code :
- e1
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.8V
- Refresh Cycles :
- 8192
- Nominal Supply Current :
- 250mA
- Memory Format :
- DRAM
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.8V
- Additional Feature :
- AUTO/SELF REFRESH
- Supply Voltage-Min (Vsup) :
- 1.7V
- Number of Pins :
- 60
- Interleaved Burst Length :
- 48
- Terminal Pitch :
- 0.8mm
- Standby Current-Max :
- 0.011A
- Density :
- 512 Mb
- Memory Type :
- Volatile
- Memory Interface :
- Parallel
- Packaging :
- Tray
- Number of Ports :
- 1
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Write Cycle Time - Word, Page :
- 15ns
- Memory Size :
- 512Mb 64M x 8
- Data Bus Width :
- 8B
- Memory Width :
- 8
- Max Supply Current :
- 120mA
- Access Time :
- 450ps
- Voltage - Supply :
- 1.7V~1.9V
- Supply Voltage-Max (Vsup) :
- 1.9V
- Datasheets
- IS43DR86400C-3DBLI
Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR86400C-3DBLI Overview
Introducing the Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR86400C-3DBLI, a cutting-edge IC DRAM designed to meet the demands of high-performance computing and data-intensive applications. With a substantial 512Mbit capacity and a parallel interface, this memory module is housed in a compact 60-ball TFBGA package, ensuring efficient space utilization and high-speed operation. Its robust design and advanced manufacturing ensure reliability and durability for industrial-grade applications, making it an ideal choice for developers looking to enhance their systems with high-quality memory solutions.
IS43DR86400C-3DBLI Features
This DRAM module offers a range of features that enhance its usability in various applications, including a high data rate, low power consumption, and a stable operating temperature range. Its 512Mbit capacity allows for substantial data storage and quick access, facilitating smoother processing and improved system performance. The 60-ball TFBGA package is optimized for efficient thermal management and reduced footprint, making it a practical choice for compact systems that require robust memory solutions.
IS43DR86400C-3DBLI Applications
- Advanced Computing Systems: Integrates seamlessly into server farms and data centers requiring high-capacity, fast-access memory for managing large volumes of data efficiently.
- Consumer Electronics: Enhances the performance of consumer electronics, such as high-end gaming consoles and smart TVs, by providing the necessary bandwidth and storage to handle complex graphics and user interfaces.
- Automotive Applications: Suitable for use in advanced driver-assistance systems (ADAS) where quick data retrieval and storage can significantly improve system responsiveness and safety features.
- Industrial Automation: Ideal for industrial control systems that require reliable and enduring memory solutions capable of operating under harsh conditions and managing complex operational data.
- Telecommunications Infrastructure: Supports telecommunications equipment with high-speed data transmission and storage capabilities needed for network management and signal processing.
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