IS43DR16640C-3DBI
- Mfr.Part #
- IS43DR16640C-3DBI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 84-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 1GBIT PARALLEL 84TWBGA
- Stock
- 24,318
- In Stock :
- 24,318
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 333MHz
- Memory Format :
- DRAM
- Memory Interface :
- Parallel
- Voltage - Supply :
- 1.7V~1.9V
- Access Time :
- 450ps
- Write Cycle Time - Word, Page :
- 15ns
- Package / Case :
- 84-TFBGA
- Operating Temperature :
- -40°C~85°C TA
- Memory Type :
- Volatile
- Memory Size :
- 1Gb 64M x 16
- Datasheets
- IS43DR16640C-3DBI
Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR16640C-3DBI Overview
The IS43DR16640C-3DBI by Integrated Silicon Solution, Inc. (ISSI) is a state-of-the-art DRAM module designed to meet the rigorous demands of modern electronic applications. Offering a robust 1Gbit storage capacity within a compact 84TWBGA package, this memory chip exemplifies high-performance and reliability. Ideal for applications requiring high-speed data processing and storage, the IS43DR16640C-3DBI incorporates advanced design techniques to ensure stability and efficiency. Its exceptional throughput and durability make it an excellent choice for developers and manufacturers aiming to enhance their systems with top-tier memory solutions. The Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR16640C-3DBI ensures your technology stays ahead with its cutting-edge capabilities and superior design.
IS43DR16640C-3DBI Features
The IS43DR16640C-3DBI DRAM chip is distinguished by several key features that make it a leading choice for high-performance computing environments. It operates on a parallel interface, facilitating faster data transfer rates essential for high-speed computing tasks. The 84TWBGA package is not only space-efficient but also offers enhanced thermal management, ensuring reliable performance even under intense operational conditions. Additionally, this memory module supports a wide range of industrial operating temperatures, making it suitable for diverse environmental settings.
IS43DR16640C-3DBI Applications
- Enterprise Servers: Utilized in server architectures to enhance data retrieval speeds and handle large volumes of transactions smoothly.
- High-performance Computing: Serves as a core component in supercomputers and research facilities requiring rapid access to large data sets.
- Telecommunications Equipment: Employs in communication infrastructure to ensure efficient data flow and storage, supporting high network reliability.
- Automotive Electronics: Integrated in advanced driver-assistance systems (ADAS) to process and store large amounts of sensor data quickly.
- Gaming Consoles: Used in next-generation gaming consoles to enhance graphics rendering and game load times through high-speed memory access.
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