HTSW-104-23-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Lead Pitch :

2.54mm

Fastening Type :

Push-Pull

Contact Finish Thickness - Post :

3.00μin 0.076μm

Additional Feature :

E.L.P.

REACH SVHC :

No SVHC

Contact Length - Mating :

0.230 5.84mm

Insulation Color :

Natural

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Current Rating (Amps) :

Varies by WireGAuge

Radiation Hardening :

No

Option :

GENERAL PURPOSE

Termination :

Solder

Shrouding :

Unshrouded

Factory Lead Time :

3 Weeks

Row Spacing - Mating :

0.100 (2.54mm)

Published :

2005

JESD-609 Code :

e4

Contact Type :

Male Pin

Moisture Sensitivity Level (MSL) :

Not Applicable

Body Depth :

0.1 inch

Mount :

Through Hole

Insulation Material :

Liquid Crystal Polymer (LCP)

Insulation Height :

0.100 2.54mm

Pbfree Code :

yes

PCB Contact Pattern :

RECTANGULAR

IEC Conformance :

No

Gender :

Male

Packaging :

Bulk

Mounting Type :

Through Hole

MIL Conformance :

No

Mating Contact Pitch :

0.1 inch

Number of Positions :

8

Pitch - Mating :

0.100 2.54mm

Style :

Board to Board or Cable

Number Of PCB Rows :

2

Number of Rows :

2

Contact Material :

Phosphor Bronze

Reliability :

COMMERCIAL

Contact Finish - Mating :

Gold

Number of Conductors :

ONE

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Connector Type :

Header

DIN Conformance :

No

Mixed Contacts :

No

Body Length or Diameter :

0.4 inch

RoHS Status :

ROHS3 Compliant

Overall Contact Length :

0.445 11.30mm

Series :

HTSW

Number of Positions Loaded :

All

Filter Feature :

No

Contact Shape :

Square

Operating Temperature :

-55°C~125°C

Material Flammability Rating :

UL94 V-0

Contact Length - Post :

0.115 2.92mm