EP3C40F780C7

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Mfr.Part #
EP3C40F780C7
Manufacturer
Altera (Intel)
Package / Case
780-BGA
Datasheet
Download
Description
IC FPGA 535 I/O 780FBGA
Stock
3
In Stock :
3

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
29mm
Operating Temperature :
0°C~85°C TJ
Terminal Finish :
TIN LEAD
Qualification Status :
Not Qualified
Number of Terminations :
780
Base Part Number :
EP3C40
Peak Reflow Temperature (Cel) :
220
JESD-609 Code :
e0
Terminal Position :
BOTTOM
Package / Case :
780-BGA
Total RAM Bits :
1161216
Height Seated (Max) :
2.4mm
Terminal Pitch :
1mm
Voltage - Supply :
1.15V~1.25V
HTS Code :
8542.39.00.01
Clock Frequency :
472.5MHz
Mounting Type :
Surface Mount
Number of I/O :
535
Packaging :
Tray
Series :
Cyclone® III
JESD-30 Code :
S-PBGA-B780
Factory Lead Time :
8 Weeks
Width :
29mm
Time@Peak Reflow Temperature-Max (s) :
30
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.2V
Surface Mount :
yes
Number of Inputs :
535
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
Non-RoHS Compliant
Number of LABs/CLBs :
2475
ECCN Code :
3A001.A.7.A
Number of Logic Elements/Cells :
39600
Number of Outputs :
535
Datasheets
EP3C40F780C7
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C40F780C7 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:780, Base Part Number:EP3C40, Package / Case:780-BGA, Mounting Type:Surface Mount, EP3C40F780C7 pinout, EP3C40F780C7 datasheet PDF, EP3C40F780C7 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C40F780C7 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3C40F780C7


FPGAs Altera EP3C40F780C7 Overview

The FPGAs Altera EP3C40F780C7, manufactured by Intel, represents a high-performance, programmable logic device designed for flexibility across various applications. This FPGA boasts a robust 780-pin FBGA (Fine-Pitch Ball Grid Array) package, allowing for efficient and reliable integration into complex hardware environments. The EP3C40F780C7 is crafted to cater to the needs of developers requiring high-speed data processing and significant I/O capabilities, with 535 I/O pins at their disposal. This component is ideal for designers aiming to develop scalable and adaptable technological solutions, offering a prime balance between performance and power consumption.

EP3C40F780C7 Features

The EP3C40F780C7 FPGA includes several features that make it a standout choice for sophisticated electronic applications. Its substantial I/O capabilities facilitate extensive interfacing with a wide range of peripheral devices. Additionally, its integration in a 780FBGA package ensures that it can handle substantial computational loads and data throughput, making it suitable for demanding operational environments. This FPGA is also known for its low power consumption, which is critical in energy-sensitive applications, helping developers maintain efficiency without sacrificing performance.

EP3C40F780C7 Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the EP3C40F780C7 enhances data flow management and supports advanced signal processing functionalities necessary for modern telecom networks.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors quickly, ensuring real-time responses essential for safety-critical applications.
  • Industrial Automation: Ideal for control systems in automated production lines, this FPGA can manage multiple input/output operations simultaneously, improving efficiency and reliability in harsh industrial settings.
  • Consumer Electronics: Used in devices such as high-definition televisions and gaming consoles, the EP3C40F780C7 helps achieve high-performance graphics processing and enhanced user interface responsiveness.
  • Medical Equipment: In medical imaging systems, it processes large data sets from advanced imaging sensors, aiding in faster and more accurate diagnostic capabilities.
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