EP3C10F256C8N
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- Mfr.Part #
- EP3C10F256C8N
- Manufacturer
- Altera (Intel)
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 182 I/O 256FBGA
- Stock
- 9,699
- In Stock ：
- 9,699
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 182
- Number of I/O :
- 182
- Terminal Form :
- Ball
- Length :
- 17mm
- RoHS Status :
- RoHS Compliant
- JESD-609 Code :
- e1
- Peak Reflow Temperature (Cel) :
- 260
- Series :
- Cyclone® III
- Voltage - Supply :
- 1.15V~1.25V
- Package / Case :
- 256-LBGA
- Total RAM Bits :
- 423936
- JESD-30 Code :
- R-PBGA-B256
- Terminal Pitch :
- 1mm
- Number of Inputs :
- 182
- Clock Frequency :
- 472.5MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Published :
- 2009
- Qualification Status :
- Not Qualified
- Base Part Number :
- EP3C10
- Number of LABs/CLBs :
- 645
- Factory Lead Time :
- 8 Weeks
- Number of Logic Elements/Cells :
- 10320
- HTS Code :
- 8542.39.00.01
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1.2V
- Packaging :
- Tray
- ECCN Code :
- EAR99
- Surface Mount :
- yes
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 1.55mm
- Terminal Position :
- BOTTOM
- Datasheets
- EP3C10F256C8N
FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C10F256C8N Overview
The FPGAs (Field Programmable Gate Array) Altera (Intel) EP3C10F256C8N is a highly versatile and performance-oriented FPGA designed by Altera, now part of Intel. This device is housed in a compact 256FBGA package and offers a robust platform for designing and deploying complex digital circuits. It is equipped with 182 I/O pins that allow for extensive connectivity and interfacing options, making it ideal for a wide range of applications that require high-speed data processing and flexible hardware configuration. The EP3C10F256C8N's ability to be programmed and re-programmed multiple times makes it an excellent choice for iterative development and prototyping, thus providing engineers and developers with a scalable and cost-effective solution.
EP3C10F256C8N Features
- High-density integration: Supports complex digital logic designs with ample room for development, allowing for more comprehensive system-on-chip (SoC) implementations.
- Low power consumption: Optimized for energy efficiency, which is critical in portable and battery-operated devices.
- High I/O pin count: Provides 182 I/O pins, facilitating broad connectivity options and supporting multiple peripherals and interfaces.
- Flexible logic resources: Enables dynamic reconfiguration, which allows for changes in logic and functionality without the need for physical hardware adjustments.
- Robust package: Enclosed in a 256FBGA package that ensures a compact footprint while providing excellent thermal and signal integrity.
EP3C10F256C8N Applications
- Consumer Electronics: Utilized in devices like high-definition televisions and gaming consoles to manage signal processing and enhance user interfaces.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple sensor inputs for features such as collision detection and parking assistance.
- Industrial Automation: Critical in the control systems of manufacturing equipment, improving precision and operational efficiency.
- Telecommunications: Applied in network routers and switches, handling data packet processing and traffic management to ensure robust network performance.
- Medical Devices: Key component in medical imaging equipment, aiding in the processing of complex data streams necessary for high-resolution imaging.
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