DA14706-00000HZ2

Manufacturer :

Renesas Electronics Corporation

Product Category :

RF Transceiver ICs

Base Product Number :

MDM-3

RF Family/Standard :

Bluetooth

Frequency :

2.4GHz

Type :

TxRx + MCU

Operating Temperature :

-55°C ~ 200°C

Data Bus Width :

32 bit

Device Core :

ARM Cortex-M33

GPIO :

79

MSL :

MSL 3 - 168 hours

Mounting Type :

Panel Mount

Number of I/Os :

79 I/O

Shell Material, Finish :

Aluminum, Yellow Chromate Plated Cadmium

Interfaces :

Serial I2C/Serial I2

Shell Size, Connector Layout :

0.050 Pitch x 0.043 Row to Row

Memory Size :

4kB OTP, 32kB ROM, 1.5MB SRAM

Wire Gauge :

-

Ingress Protection :

-

Modulation :

-

Product Type :

RF System on a Chip - SoC

Material Flammability Rating :

-

Series :

83513-Style Micro D Metal Shell (MDM)

Color :

-

Number of Positions :

37

Supplier Device Package :

142-VFBGA (6.2x6)

Voltage - Supply :

2.9V ~ 4.75V

Qualification :

-

Termination :

Wire Leads

Current Rating (Amps) :

3A

Connector Style :

D-Type, Micro-D

Connector Type :

Receptacle, Female Sockets

Mounting Style :

SMD/SMT

Voltage Rating :

-

Power - Output :

6dBm

Maximum Data Rate :

6 Mbps

Protocol :

Bluetooth v5.2

Package :

Bulk

Contact Type :

Signal

Output Power :

6 dBm

Contact Finish Thickness :

-

Contact Material :

COPPER ALLOY

Number of Rows :

2

Program Memory Size :

-

Contact Finish :

Gold

Flange Feature :

Cable Side, Male Jackscrew (2-56)

Subcategory :

Wireless and RF Integrated Circuits

Technology :

Si

Package / Case :

142-VFBGA

Maximum Operating Temperature :

+ 85 C

Operating Frequency :

2.4 GHz

Current - Receiving :

1.85mA

Data Rate (Max) :

-

Backset Spacing :

-

Product Status :

Active

Sensitivity :

-97dBm

Current - Transmitting :

1.1mA ~ 5.2mA

Serial Interfaces :

I²C, I²S, PCM, SPI, UART, USB

Features :

Shielded

Contact Form :

-

Minimum Operating Temperature :

- 40 C

Dielectric Material :

Liquid Crystal Polymer (LCP)