CYV15G0403DXB-BGI

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Mfr.Part #
CYV15G0403DXB-BGI
Manufacturer
Infineon Technologies
Package / Case
256-LBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
100
In Stock :
100

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Series :
HOTlink II™
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Function :
Transceiver
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1.27mm
Mount :
Surface Mount
Number of Terminations :
256
Number of Circuits :
4
Package / Case :
256-LBGA Exposed Pad
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Lead (Sn/Pb)
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Packaging :
Tray
Terminal Form :
Ball
Number of Transceivers :
4
Voltage - Supply :
3.135V~3.465V
Number of Pins :
256
Data Rate :
1500000 Mbps
Time@Peak Reflow Temperature-Max (s) :
30
Interface :
LVTTL
Current - Supply :
900mA
Base Part Number :
CY*15G04
Operating Temperature :
-40°C~85°C
Length :
27mm
Mounting Type :
Surface Mount
Width :
27mm
Supply Voltage :
3.3V
Operating Supply Voltage :
3.3V
Nominal Supply Current :
1.32A
Qualification Status :
Not Qualified
Published :
2003
Datasheets
CYV15G0403DXB-BGI
Introducing Telecom Infineon Technologies CYV15G0403DXB-BGI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Package / Case:256-LBGA Exposed Pad, Number of Pins:256, Base Part Number:CY*15G04, Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, CYV15G0403DXB-BGI pinout, CYV15G0403DXB-BGI datasheet PDF, CYV15G0403DXB-BGI amp .Beyond Telecom Infineon Technologies CYV15G0403DXB-BGI ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYV15G0403DXB-BGI


Telecom Infineon Technologies CYV15G0403DXB-BGI Overview

The Infineon Technologies CYV15G0403DXB-BGI IC is a state-of-the-art telecom interface chip, designed to deliver reliable, high-speed performance in complex telecommunications infrastructure equipment. As an integral component of modern telecom networks, this IC enhances data transmission capabilities and improves overall system efficiency with its advanced design and Infineon's cutting-edge technology. Its compact 256 BGA package ensures a reduced footprint while maintaining robust functionality, making the Telecom Infineon Technologies CYV15G0403DXB-BGI a perfect choice for high-demand applications that require durability and precision.

CYV15G0403DXB-BGI Features

The CYV15G0403DXB-BGI features include high-speed data interfaces, low power consumption, and advanced signal integrity tools which are crucial for managing complex data streams in telecom networks. Additionally, its enhanced security protocols provide robust protection against a variety of digital threats, ensuring reliable and secure communications.

CYV15G0403DXB-BGI Applications

  • Telecommunications Networks: Utilized in switches and routers to manage data flow efficiently across networks.
  • Mobile Base Stations: Enhances the reliability and efficiency of data transmission between the base station and mobile devices.
  • Broadband Access Systems: Critical in broadband modems and access devices, facilitating faster data rates and improved connectivity.
  • Network Interface Cards: Used in the fabrication of NICs to provide faster and more reliable network communications.
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