CYV15G0101DXB-BBXC
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- Mfr.Part #
- CYV15G0101DXB-BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 100-LBGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 100TBGA
- Stock
- 40,395
- In Stock ：
- 40,395
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Lead Free :
- Lead Free
- JESD-609 Code :
- e1
- Width :
- 11mm
- Number of Transceivers :
- 1
- Function :
- Transceiver
- Telecom IC Type :
- INTERFACE CIRCUIT
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mount :
- Surface Mount
- Voltage - Supply :
- 3.135V~3.465V
- Terminal Form :
- Ball
- Nominal Supply Current :
- 500mA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 3.3V
- Pbfree Code :
- yes
- Number of Channels :
- 1
- Operating Temperature :
- 0°C~70°C
- Terminal Position :
- BOTTOM
- Number of Terminations :
- 100
- Packaging :
- Tray
- Interface :
- LVTTL
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 100
- Radiation Hardening :
- No
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Base Part Number :
- CY*15G01
- Operating Supply Voltage :
- 3.3V
- Factory Lead Time :
- 15 Weeks
- Mounting Type :
- Surface Mount
- Series :
- HOTlink II™
- Current - Supply :
- 390mA
- Published :
- 2004
- Package / Case :
- 100-LBGA
- Peak Reflow Temperature (Cel) :
- 260
- Datasheets
- CYV15G0101DXB-BBXC
Telecom Infineon Technologies CYV15G0101DXB-BBXC Overview
Introducing the CYV15G0101DXB-BBXC by Infineon Technologies, a state-of-the-art Integrated Circuit designed specifically for telecom interfaces. This IC is housed in a 100TBGA package, ensuring robust performance in a compact form. As part of Infineon Technologies' commitment to high-quality and reliable telecom solutions, the CYV15G0101DXB-BBXC is engineered to meet the rigorous demands of modern telecommunications infrastructure. The product excels in environments requiring high-speed data transmission and connectivity enhancements, making it an indispensable component for industry-leading telecom systems.
CYV15G0101DXB-BBXC Features
The CYV15G0101DXB-BBXC boasts several key features that set it apart in the telecom industry. These include advanced interface capabilities suitable for high-speed data transfers, excellent signal integrity, low power consumption, and high reliability under varying operational conditions. Additionally, the 100TBGA packaging allows for efficient space utilization in complex circuit designs, enhancing the overall design flexibility and scalability of telecom systems.
CYV15G0101DXB-BBXC Applications
- Data Centers: Utilized in server and storage systems to enhance data transmission rates and reliability, enabling faster and more secure data handling capabilities.
- Telecommunication Equipment: Integral in the development of both wired and wireless communication systems, improving signal processing and transmission capabilities.
- Networking Infrastructure: Supports robust networking solutions by facilitating improved data throughput and stability across network hardware.
- Broadband Access: Deployed in broadband technology including DSL, fiber optics, and cable systems, crucial for amplifying data transmission efficiency and bandwidth management.
- Consumer Electronics: Applied in consumer devices that require high-speed telecommunications interfaces, such as smart TVs and gaming consoles, enhancing user experiences with superior connectivity.
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