CYDD18S72V18-167BBXC
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- Mfr.Part #
- CYDD18S72V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 39,112
- In Stock ：
- 39,112
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Package / Case :
- 256-LBGA
- Memory Format :
- SRAM
- Access Time :
- 600ps
- Operating Supply Voltage :
- 1.8V
- Sync/Async :
- SYNCHRONOUS
- Density :
- 18 Mb
- Pin Count :
- 484
- Supply Voltage :
- 1.5V
- Word Size :
- 72b
- Operating Temperature :
- 0°C~70°C TA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Clock Frequency :
- 167MHz
- Nominal Supply Current :
- 980mA
- Lead Free :
- Lead Free
- JESD-609 Code :
- e1
- Peak Reflow Temperature (Cel) :
- 260
- Number of Terminations :
- 484
- Number of Pins :
- 256
- Base Part Number :
- CYDD
- Address Bus Width :
- 36b
- Memory Interface :
- Parallel
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- S-PBGA-B484
- Qualification Status :
- Not Qualified
- Published :
- 2006
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
- Memory Width :
- 72
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Number of Ports :
- 2
- Number of Functions :
- 1
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Memory Type :
- Volatile
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Supply Voltage-Max (Vsup) :
- 1.58V
- Packaging :
- Tray
- Memory Size :
- 18Mb 256K x 36 x 2 256K x 72
- Datasheets
- CYDD18S72V18-167BBXC
Memory Infineon Technologies CYDD18S72V18-167BBXC Overview
The Memory Infineon Technologies CYDD18S72V18-167BBXC is an advanced 18Mbit SRAM component designed for high-performance data buffering in computing and telecommunications infrastructure. With its high-speed parallel interface and a compact 256FBGA package, this memory module ensures reliable, rapid access to data, critical for modern high-speed applications. Its robust storage capacity and efficient architecture make it ideal for systems requiring fast and durable memory solutions, particularly in sectors demanding prolonged service life and operational stability.
CYDD18S72V18-167BBXC Features
This IC SRAM module features 18Mbit of storage, provided in a high-density 256FBGA package that optimizes board space and enhances thermal performance. The parallel interface facilitates quick data transfer rates that are essential for high-throughput applications, ensuring minimal latency and increased system efficiency. Designed by Infineon Technologies, a leader in semiconductor solutions, the CYDD18S72V18-167BBXC guarantees high reliability and performance under a wide range of environmental conditions.
CYDD18S72V18-167BBXC Applications
- High-Performance Computing: Utilizes its rapid data access capabilities to manage large-scale computations and data analysis efficiently.
- Networking Equipment: Enhances the performance of routers and switches by providing high-speed buffering of data packets, ensuring efficient network traffic management.
- Telecommunications Systems: Critical for use in telecommunications infrastructure, where quick data retrieval is necessary for signal processing and real-time communication.
- Industrial Automation: Supports reliable and quick data management in industrial control systems, crucial for real-time monitoring and control.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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