CYDD09S36V18-167BBXC

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Mfr.Part #
CYDD09S36V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
40,545
In Stock :
40,545

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1.8V
Radiation Hardening :
No
I/O Type :
COMMON
Operating Temperature :
0°C~70°C TA
Memory Size :
9Mb 128K x 36 x 2
Supply Voltage-Max (Vsup) :
1.58V
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Output Characteristics :
3-STATE
Packaging :
Tray
Number of Functions :
1
Height Seated (Max) :
1.7mm
Memory Type :
Volatile
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
JESD-609 Code :
e1
Clock Frequency :
167MHz
Peak Reflow Temperature (Cel) :
260
Lead Free :
Lead Free
Number of Ports :
2
Number of Terminations :
256
Memory Interface :
Parallel
Package / Case :
256-LBGA
Memory Width :
72
Address Bus Width :
34b
Supply Voltage :
1.5V
Mount :
Surface Mount
Mounting Type :
Surface Mount
Memory Format :
SRAM
Pin Count :
256
Pbfree Code :
yes
Density :
9 Mb
Terminal Position :
BOTTOM
Standby Voltage-Min :
1.5V
Access Time :
600ps
Word Size :
36b
Sync/Async :
SYNCHRONOUS
RoHS Status :
ROHS3 Compliant
Length :
17mm
Published :
2006
Base Part Number :
CYDD
Nominal Supply Current :
560mA
Number of Pins :
256
Terminal Pitch :
1mm
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
Introducing Memory Infineon Technologies CYDD09S36V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Number of Terminations:256, Package / Case:256-LBGA, Mounting Type:Surface Mount, Base Part Number:CYDD, Number of Pins:256, CYDD09S36V18-167BBXC pinout, CYDD09S36V18-167BBXC datasheet PDF, CYDD09S36V18-167BBXC amp .Beyond Memory Infineon Technologies CYDD09S36V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYDD09S36V18-167BBXC


Memory Infineon Technologies CYDD09S36V18-167BBXC Overview

The Memory Infineon Technologies CYDD09S36V18-167BBXC is a high-performance 9Mbit SRAM chip designed for applications requiring rapid access and storage of large amounts of data. Manufactured by Infineon Technologies, this IC leverages advanced fabrication techniques to provide exceptional reliability and speed, encapsulated in a compact 256FBGA package. It is engineered to support the rigorous demands of high-speed data environments, making it ideal for a wide range of industrial and commercial applications. The integration of this memory component into your systems ensures minimal latency, enhanced throughput, and increased efficiency in data processing tasks, critical for systems requiring fast and reliable memory solutions.

CYDD09S36V18-167BBXC Features

This SRAM component boasts several features that make it stand out in the competitive memory chip market. It offers a large 9MB storage capacity within a parallel interface structure, ensuring swift data access and manipulation. The 256FBGA packaging not only provides robust protection but also ensures optimal thermal management and space efficiency in circuit designs. Moreover, its compatibility with various standard operating voltages and temperatures makes it versatile for integration into diverse hardware configurations.

CYDD09S36V18-167BBXC Applications

  • Networking Equipment: Used in routers and switches to enhance packet buffer management, ensuring efficient data flow and reduced latency in network communications.
  • High-performance Computing: Serves as cache memory in servers and workstations, improving processing speed and responsiveness in complex computational tasks.
  • Aerospace and Defense: Deployed in avionics for real-time data processing and storage, crucial for mission-critical applications requiring robust, fail-safe memory.
  • Automotive: Utilized in advanced driver-assistance systems (ADAS) to temporarily store sensor data, aiding in real-time decision making and vehicle automation.
  • Telecommunications: Employs in telecommunications infrastructure to manage real-time voice and video data streams, optimizing signal integrity and service quality.
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