CSD22205L
- Mfr.Part #
- CSD22205L
- Manufacturer
- Texas Instruments
- Package / Case
- 4-XFLGA
- Datasheet
- Download
- Description
- MOSFET P-CH 8V 7.4A 4PICOSTAR
- Stock
- 3,710
- In Stock :
- 3,710
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- Manufacturer :
- Texas Instruments
- Product Category :
- Transistors - FETs, MOSFETs - Single
- FET Type :
- P-Channel
- Length :
- 1.16mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Rds On (Max) @ Id, Vgs :
- 9.9m Ω @ 1A, 4.5V
- Surface Mount :
- yes
- Input Capacitance (Ciss) (Max) @ Vds :
- 1390pF @ 4V
- Base Part Number :
- CSD22205
- RoHS Status :
- ROHS3 Compliant
- Current - Continuous Drain (Id) @ 25°C :
- 7.4A Ta
- ECCN Code :
- EAR99
- Drive Voltage (Max Rds On,Min Rds On) :
- 1.5V 4.5V
- Mounting Type :
- Surface Mount
- Vgs (Max) :
- -6V
- Vgs(th) (Max) @ Id :
- 1.05V @ 250μA
- Thickness :
- 330μm
- Package / Case :
- 4-XFLGA
- Lifecycle Status :
- ACTIVE (Last Updated: 1 day ago)
- Terminal Form :
- NO LEAD
- Feedback Cap-Max (Crss) :
- 250 pF
- Pulsed Drain Current-Max (IDM) :
- 71A
- Transistor Element Material :
- SILICON
- Transistor Application :
- SWITCHING
- Power Dissipation-Max :
- 600mW Ta
- Drain to Source Voltage (Vdss) :
- 8V
- Number of Elements :
- 1
- Factory Lead Time :
- 16 Weeks
- Number of Pins :
- 4
- Gate Charge (Qg) (Max) @ Vgs :
- 8.5nC @ 4.5V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Element Configuration :
- Single
- Packaging :
- Tape and Reel (TR)
- Pbfree Code :
- yes
- Width :
- 1.16mm
- Number of Terminations :
- 4
- Series :
- NexFET™
- DS Breakdown Voltage-Min :
- 8V
- Operating Temperature :
- -55°C~150°C TJ
- Operating Mode :
- ENHANCEMENT MODE
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Datasheets
- CSD22205L

P-Channel Tape & Reel (TR) 9.9m Ω @ 1A, 4.5V -6V 1390pF @ 4V 8.5nC @ 4.5V 8V 4-XFLGA
CSD22205L Description
This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET? device has been designed to deliver the lowest on-resistance and gate charge in
the smallest outline possible with excellent thermal characteristics in an ultra-low profile. The Land Grid Array (LGA) package is a silicon chip scale package
with metal pads instead of solder balls.
CSD22205L Features
Low resistance
Small footprint 1.2 mm × 1.2 mm
Low profile 0.36-mm height
Lead free
Gate-source voltage clamp
Gate ESD protection
RoHS compliant
Halogen free
CSD22205L Applications
Battery management
Load switch
Battery protection
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