BZB84-C56215

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

JEDEC-95 Code :

TO-236AB

ESD Protection :

No

Peak Reflow Temperature (Cel) :

260

Pin Count :

3

Impedance-Max :

200Ohm

JESD-609 Code :

e3

Published :

2009

Factory Lead Time :

4 Weeks

Element Configuration :

Common Anode

Diode Type :

ZENER DIODE

Reference Standard :

AEC-Q101; IEC-60134

Current - Reverse Leakage @ Vr :

50nA @ 39.2V

RoHS Status :

ROHS3 Compliant

Contact Plating :

Tin

Diode Element Material :

SILICON

Tolerance :

±5%

Mounting Type :

Surface Mount

Package / Case :

TO-236-3, SC-59, SOT-23-3

Reference Voltage :

56V

Max Operating Temperature :

150°C

Zener Voltage :

56V

Mount :

Surface Mount

Packaging :

Tape and Reel (TR)

Number of Elements :

2

JESD-30 Code :

R-PDSO-G3

ECCN Code :

EAR99

Terminal Position :

Dual

Test Current :

2mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Impedance :

200Ohm

Voltage Tol-Max :

5%

Max Power Dissipation :

300mW

Terminal Form :

Gull wing

Polarity :

Unidirectional

Number of Terminations :

3

Time@Peak Reflow Temperature-Max (s) :

30

HTS Code :

8541.10.00.50

Configuration :

1 Pair Common Anode

Max Reverse Leakage Current :

50nA