BZB84-B5V6215

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Contact Plating :

Tin

Terminal Form :

Gull wing

Diode Type :

ZENER DIODE

Peak Reflow Temperature (Cel) :

260

Pin Count :

3

Max Power Dissipation :

300mW

Zener Voltage :

5.6V

Voltage Tol-Max :

2%

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Polarity :

Unidirectional

Test Current :

5mA

Mounting Type :

Surface Mount

Factory Lead Time :

4 Weeks

Mount :

Surface Mount

Reference Voltage :

5.6V

Number of Pins :

3

Voltage Tolerance :

2%

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Published :

2009

Number of Terminations :

3

RoHS Status :

ROHS3 Compliant

Current - Reverse Leakage @ Vr :

1μA @ 2V

Tolerance :

±2%

Impedance-Max :

40Ohm

JESD-609 Code :

e3

Package / Case :

TO-236-3, SC-59, SOT-23-3

Diode Element Material :

SILICON

Operating Temperature :

-55°C~150°C TA

Configuration :

1 Pair Common Anode

Terminal Position :

Dual

Impedance :

40Ohm

ESD Protection :

No

Max Reverse Leakage Current :

1μA

ECCN Code :

EAR99

Element Configuration :

Common Anode

HTS Code :

8541.10.00.50

Number of Elements :

2

Power Dissipation :

300mW

Time@Peak Reflow Temperature-Max (s) :

30

Packaging :

Tape and Reel (TR)