BZB84-B24215

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

ESD Protection :

No

Number of Terminations :

3

Impedance-Max :

70Ohm

Diode Element Material :

SILICON

Contact Plating :

Tin

Element Configuration :

Common Anode

Mount :

Surface Mount

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Voltage Tolerance :

2%

Pin Count :

3

Package / Case :

TO-236-3, SC-59, SOT-23-3

Max Operating Temperature :

150°C

Zener Current :

200mA

JESD-609 Code :

e3

Max Power Dissipation :

300mW

Configuration :

1 Pair Common Anode

Number of Elements :

2

Reference Voltage :

24V

Mounting Type :

Surface Mount

Tolerance :

±2%

ECCN Code :

EAR99

Test Current :

5mA

Zener Voltage :

24V

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Max Reverse Leakage Current :

50nA

Terminal Form :

Gull wing

Impedance :

70Ohm

Diode Type :

ZENER DIODE

Factory Lead Time :

4 Weeks

Number of Pins :

3

HTS Code :

8541.10.00.50

Peak Reflow Temperature (Cel) :

260

Packaging :

Tape and Reel (TR)

Voltage Tol-Max :

2%

Current - Reverse Leakage @ Vr :

50nA @ 16.8V

Power Dissipation :

300mW

RoHS Status :

ROHS3 Compliant

Published :

2009

Polarity :

Unidirectional

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Position :

Dual