BZB784-C2V7,115

Manufacturer :

NXP Semiconductors

Product Category :

Diodes - Zener - Arrays

Tolerance :

±5%

Packaging :

Tape and Reel (TR)

Current - Reverse Leakage @ Vr :

20μA @ 1V

Number of Elements :

2

Voltage Tol-Max :

5%

Mounting Type :

Surface Mount

Number of Terminations :

3

ECCN Code :

EAR99

Element Configuration :

Common Anode

Min Operating Temperature :

-65°C

Factory Lead Time :

4 Weeks

Impedance-Max :

100Ohm

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Zener Voltage :

2.7V

Impedance :

100Ohm

Pin Count :

3

Configuration :

1 Pair Common Anode

Contact Plating :

Tin

ESD Protection :

yes

Radiation Hardening :

No

Max Power Dissipation :

180mW

Number of Pins :

70

Published :

2007

Diode Type :

ZENER DIODE

Power Dissipation :

350mW

Time@Peak Reflow Temperature-Max (s) :

40

Peak Reflow Temperature (Cel) :

260

RoHS Status :

ROHS3 Compliant

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Reference Voltage :

2.7V

JESD-30 Code :

R-PDSO-G3

Test Current :

5mA

Max Reverse Leakage Current :

20μA

Diode Element Material :

SILICON

HTS Code :

8541.10.00.50

Max Operating Temperature :

150°C

Terminal Form :

Gull wing

Mount :

Surface Mount

Voltage Tolerance :

5%

Polarity :

Unidirectional

Package / Case :

SC-70, SOT-323

Terminal Position :

Dual

JESD-609 Code :

e3