AM3356BZCZ30

Manufacturer :

Texas Instruments

Product Category :

Microprocessors

Terminal Pitch :

0.8mm

Supply Current-Max :

400mA

Package / Case :

324-LFBGA

Memory Type :

L2 Cache, RAM, ROM

Packaging :

Tray

Factory Lead Time :

6 Weeks

Number of UART Channels :

6

Peak Reflow Temperature (Cel) :

260

Number of Cores :

1

Operating Temperature :

0°C~90°C TJ

Surface Mount :

yes

Boundary Scan :

yes

USB :

USB 2.0 + PHY (2)

Supply Voltage :

1.1V

Frequency :

300MHz

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Integrated Cache :

yes

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Pbfree Code :

yes

RAM Size :

64KB

Base Part Number :

AM3356

Security Features :

Cryptography, Random Number Generator

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RoHS Status :

ROHS3 Compliant

Weight :

1.713814g

Core Processor :

ARM® Cortex®-A8

ECCN Code :

5A992.C

Terminal Position :

BOTTOM

JESD-609 Code :

e1

Thickness :

900μm

Length :

15mm

Number of Pins :

324

Series :

Sitara™

Height :

1.4mm

Width :

15mm

Voltage - I/O :

1.8V 3.3V

Bit Size :

32

Core Architecture :

ARM

Lifecycle Status :

ACTIVE (Last Updated: 1 week ago)

Low Power Mode :

yes

Display & Interface Controllers :

LCD, Touchscreen

Graphics Acceleration :

yes

Number of Terminations :

324

Voltage :

1.144V

Additional Interfaces :

CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

Lead Free :

Lead Free

Interface :

CAN, Ethernet, I2C, SPI, UART, USB

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Data Bus Width :

32b

RAM Controllers :

LPDDR, DDR2, DDR3, DDR3L

Ethernet :

10/100/1000Mbps (2)

Contact Plating :

Copper, Silver, Tin

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Operating Supply Voltage :

1.1V

Format :

FIXED POINT

Qualification Status :

Not Qualified