93944-111HLF
- Mfr.Part #
- 93944-111HLF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 11POS 2.54MM
- Stock
- 25,175
- In Stock :
- 25,175
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- Headers, Male Pins
- Insulation Color :
- Black
- Packaging :
- Bulk
- Insulation Height :
- 0.100 2.54mm
- Color :
- Black
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mating Post Length :
- 18.06mm
- Housing Color :
- Black
- Max Operating Temperature :
- 125°C
- Mounting Type :
- Through Hole
- Pitch - Mating :
- 0.100 2.54mm
- Insulation Resistance :
- 5GOhm
- Shrouding :
- Unshrouded
- Radiation Hardening :
- No
- Min Operating Temperature :
- -65°C
- Orientation :
- Straight
- RoHS Status :
- RoHS Compliant
- Contact Shape :
- Square
- Contact Length - Post :
- 0.130 3.30mm
- Contact Finish - Mating :
- Gold or Gold, GXT™
- Housing Material :
- Thermoplastic
- Style :
- Board to Board
- Contact Material :
- Phosphor Bronze
- Series :
- BERGSTIK® II
- Max Voltage Rating (AC) :
- 1.5kV
- Contact Length - Mating :
- 0.711 18.06mm
- Contact Gender :
- Male
- Voltage - Rated :
- 1.5kV
- Length :
- 27.94mm
- Contact Plating :
- GXT, Gold
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Number of Positions :
- 11
- Lead Length :
- 3.3mm
- Flammability Rating :
- UL94 V-0
- Number of Rows :
- 1
- Number of Positions Loaded :
- All
- Depth :
- 2.41mm
- Fastening Type :
- Push-Pull
- Contact Type :
- Male Pin
- Number of Contacts :
- 11
- Material Flammability Rating :
- UL94 V-0
- Termination :
- Solder
- Current Rating :
- 3A
- Pitch :
- 2.54mm
- Overall Contact Length :
- 0.941 23.90mm
- Connector Type :
- Header
- Mount :
- Through Hole
- Datasheets
- 93944-111HLF

BERGSTIK® II Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ 11-Position Board to Board 0.100 2.54mm Height
93944-111HLF Overview
The packaging contains Header.There is a Through Hole mounting type for the device.This product is packaged in a case marked Bulk.Product number BERGSTIK® II belongs to the BERGSTIK® II Series.Whenever the temperature is below 125°C, it's best.There is a minimum temperature requirement of [0°C] for this device.There is a Through Hole mount on the part.
93944-111HLF Features
BERGSTIK® II series
93944-111HLF Applications
There are a lot of Amphenol ICC (FCI)
93944-111HLF Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















