66AK2L06XCMS2
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- Mfr.Part #
- 66AK2L06XCMS2
- Manufacturer
- Texas Instruments
- Package / Case
- 900-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC MULTICORE DSP+ARM 900BGA
- Stock
- 13,304
- In Stock ：
- 13,304
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- RAM Size :
- 1Mb
- Voltage - Core :
- Variable
- Thickness :
- 2.98mm
- Lifecycle Status :
- ACTIVE (Last Updated: 1 week ago)
- Non-Volatile Memory :
- ROM (384kB)
- Package / Case :
- 900-BFBGA, FCBGA
- On Chip Data RAM :
- 5.384MB
- Series :
- 66AK2Lx KeyStone Multicore
- Voltage - I/O :
- 0.85V 1.0V 1.8V 3.3V
- Lead Free :
- Lead Free
- Mount :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Frequency :
- 1.2GHz
- Data Bus Width :
- 32b
- Length :
- 25mm
- Packaging :
- Tray
- Width :
- 25mm
- Operating Temperature :
- 0°C~100°C TC
- Contact Plating :
- Copper, Silver, Tin
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Pins :
- 900
- Number of UART Channels :
- 4
- Type :
- DSP+ARM®
- Factory Lead Time :
- 12 Weeks
- Base Part Number :
- 66AK2L06
- Mounting Type :
- Surface Mount
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
- Datasheets
- 66AK2L06XCMS2
DSP Texas Instruments 66AK2L06XCMS2 Overview
The DSP Texas Instruments 66AK2L06XCMS2 is a highly sophisticated system on chip (SoC) that combines advanced DSP capabilities with ARM Cortex processors. This integration provides an optimal solution for high-performance applications requiring intensive signal processing and efficient control within a single platform. The 66AK2L06XCMS2 is encased in a 900-ball BGA package, designed to deliver exceptional speed and reliability for complex computational tasks. The integration of multicore DSP and ARM architecture makes it a go-to solution for developers looking to streamline their systems with high-end processing power and low power consumption, ensuring operational efficiency and enhanced system design.
66AK2L06XCMS2 Features
The 66AK2L06XCMS2 from Texas Instruments boasts several key features that make it a standout choice for demanding electronic environments. These include a high-speed multicore architecture combining both DSP and ARM cores, extensive I/O capabilities, and advanced security protocols. The component’s high bandwidth and scalable multicore processing provide ample support for complex algorithms and data-intensive applications, enabling robust and flexible system development.
66AK2L06XCMS2 Applications
- Telecommunications Equipment: The 66AK2L06XCMS2 excels in processing complex algorithms required for data transmission and signal processing, enhancing performance and efficiency in communication infrastructures.
- Industrial Automation: This SoC supports robust and precise control systems used in automated manufacturing processes, integrating easily with sensors and actuators to manage tasks efficiently.
- Medical Imaging Devices: By harnessing the power of both DSP and ARM cores, the 66AK2L06XCMS2 processes high volumes of data required for real-time medical imaging, aiding in quicker diagnosis and enhanced imaging clarity.
- Aerospace and Defense Systems: The chip's advanced security features and high processing capabilities make it suitable for applications in aerospace and defense, where reliability and data integrity are paramount.
- Audio and Video Processing Units: Ideal for multimedia applications, the 66AK2L06XCMS2 efficiently handles audio and video processing tasks, providing smooth and high-quality output.
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