643464-2
- Mfr.Part #
- 643464-2
- Manufacturer
- TE Connectivity AMP Connectors
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 7POS 3.96MM
- Stock
- 44
- In Stock :
- 44
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- * Fullname:
- * Company:
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- Comment:
- * Quantity:
- Manufacturer :
- TE Connectivity AMP Connectors
- Product Category :
- Headers, Male Pins
- Current Rating (Amps) :
- Varies by WireGAuge
- Number of Conductors :
- ONE
- Body Breadth :
- 0.3 inch
- Number of Positions Loaded :
- 6
- ECCN Code :
- EAR99
- Fastening Type :
- Friction Lock
- MIL Conformance :
- No
- IEC Conformance :
- No
- Mount :
- Through Hole
- Current Rating :
- 7A
- Connector Type :
- Header
- Packaging :
- Bulk
- Number of Rows :
- 1
- Contact Length - Post :
- 0.125 3.18mm
- Voltage - Rated AC :
- 600V
- Contact Shape :
- Square
- Housing Color :
- Natural
- Height :
- 10.8mm
- Approval Agency :
- CSA
- PCB Contact Pattern :
- RECTANGULAR
- Operating Temperature :
- -55°C~105°C
- Plating Thickness :
- 2.54μm
- Contact Current Rating :
- 7A
- Published :
- 2012
- Insulation Height :
- 0.425 10.80mm
- Number of Power Positions :
- 7
- Shrouding :
- Shrouded - 1 Wall
- Contact Length - Mating :
- 0.400 10.16mm
- Operating Supply Voltage :
- 600V
- Orientation :
- Vertical
- Contact Material :
- COPPER ALLOY
- Length :
- 27.74mm
- DIN Conformance :
- No
- JESD-609 Code :
- e3
- Applications :
- General Purpose, Industrial
- Flammability Rating :
- UL94 V-0
- Mating Post Length :
- 10.16mm
- Factory Lead Time :
- 16 Weeks
- Contact Gender :
- Male
- Lifecycle Status :
- ACTIVE (Last Updated: 2 days ago)
- Pbfree Code :
- yes
- Lead Length :
- 3.18mm
- Mixed Contacts :
- No
- Circuit Application :
- Power
- Filter Feature :
- No
- Overall Contact Length :
- 0.650 16.51mm
- Material Flammability Rating :
- UL94 V-0
- PCB Thickness :
- 3.18mm
- Contact Type :
- Male Pin
- Number Of PCB Rows :
- 1
- Body Depth :
- 0.425 inch
- Contact Retention :
- Without
- Housing Material :
- Polyester
- Voltage - Rated :
- 600VAC
- Mounting Type :
- Through Hole
- ELV :
- Compliant
- Sealable :
- No
- Termination :
- Solder
- Polarization Key :
- POLARIZED HOUSING
- RoHS Status :
- RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Underplate Material :
- Nickel
- Style :
- Board to Cable/Wire
- Pitch - Mating :
- 0.156 3.96mm
- Reliability :
- COMMERCIAL
- Lead Free :
- Lead Free
- Insulation Material :
- Thermoplastic, Glass Filled
- Contact Finish - Mating :
- Tin
- Series :
- MTA-156
- Datasheets
- 643464-2

MTA-156 Series 1-Row Header Solder Copper Alloy Bulk Through Hole Tin Thermoplastic, Glass Filled Board to Cable/Wire 0.425 10.80mm Height
643464-2 Overview
This product is packaged in a Header box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the MTA-156 Series.There is the possibility of using the device for General Purpose, Industrial.By Through Hole, the part is mounted.The operating voltage of this memory is 600V.Operating temperature is set to -55°C~105°C.
643464-2 Features
MTA-156 series
643464-2 Applications
There are a lot of TE Connectivity AMP Connectors
643464-2 Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















