5SGXMA4H3F35C2LN
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- Mfr.Part #
- 5SGXMA4H3F35C2LN
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1152FBGA
- Stock
- 39,565
- In Stock ：
- 39,565
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Organization :
- 15850 CLBS
- Factory Lead Time :
- 8 Weeks
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Width :
- 35mm
- Length :
- 35mm
- Number of Logic Elements/Cells :
- 420000
- Number of Inputs :
- 552
- Number of I/O :
- 552
- RoHS Status :
- RoHS Compliant
- Series :
- Stratix® V GX
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 0.82V~0.88V
- Number of Outputs :
- 552
- Total RAM Bits :
- 37888000
- Surface Mount :
- yes
- Package / Case :
- 1152-BBGA, FCBGA
- Height Seated (Max) :
- 3.6mm
- Base Part Number :
- 5SGXMA4
- Number of LABs/CLBs :
- 158500
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Supply Voltage :
- 0.85V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-30 Code :
- S-PBGA-B1152
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Datasheets
- 5SGXMA4H3F35C2LN
FPGAs Altera (Intel) 5SGXMA4H3F35C2LN Overview
The FPGAs Altera (Intel) 5SGXMA4H3F35C2LN represents a high-performance, field-programmable gate array designed to meet the demanding needs of modern digital applications. Manufactured by Altera, now part of Intel, this FPGA features a flexible architecture and a high-density 1152-pin FBGA package, ensuring robust functionality and adaptability. As industries push for higher speeds, more reliable processing, and versatile hardware options, the 5SGXMA4H3F35C2LN stands out as a critical component in advanced electronics design, particularly suited for businesses looking to leverage technology for competitive advantages.
5SGXMA4H3F35C2LN Features
This FPGA is equipped with 600 user I/Os, providing ample connectivity for various peripherals and integration into existing systems. The high I/O count is essential for complex designs that require numerous connections to other modules or devices. The 1152FBGA packaging not only ensures a compact form factor but also enhances the thermal management capabilities of the device, which is crucial for maintaining performance stability under load.
5SGXMA4H3F35C2LN Applications
- Data Centers: Utilized in server infrastructure to facilitate rapid data processing and efficient load management, enhancing overall data throughput and reliability.
- Telecommunications: Critical for developing infrastructure that supports high-speed data transmission and advanced signal processing capabilities.
- Automotive Electronics: Integrated into driver assistance systems to process real-time sensor data and support advanced vehicle functionalities.
- Medical Devices: Used in medical imaging systems to handle complex computations required for real-time imaging and diagnostics.
- Industrial Automation: Empowers automation systems with the ability to handle multiple control tasks simultaneously, optimizing operational efficiency and precision.
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