5SGXEB6R2F40C2N
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- Mfr.Part #
- 5SGXEB6R2F40C2N
- Manufacturer
- Altera (Intel)
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 432 I/O 1517FBGA
- Stock
- 15,675
- In Stock ：
- 15,675
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Surface Mount :
- yes
- Factory Lead Time :
- 8 Weeks
- Mounting Type :
- Surface Mount
- Organization :
- 22540 CLBS
- JESD-30 Code :
- S-PBGA-B1517
- Packaging :
- Tray
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 432
- Terminal Position :
- BOTTOM
- Base Part Number :
- 5SGXEB6
- Height Seated (Max) :
- 3.5mm
- Series :
- Stratix® V GX
- Number of I/O :
- 432
- Total RAM Bits :
- 53248000
- Number of Logic Elements/Cells :
- 597000
- Supply Voltage :
- 0.9V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Number of LABs/CLBs :
- 225400
- Terminal Pitch :
- 1mm
- Length :
- 40mm
- Voltage - Supply :
- 0.87V~0.93V
- Terminal Form :
- Ball
- Number of Inputs :
- 432
- RoHS Status :
- RoHS Compliant
- Package / Case :
- 1517-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Width :
- 40mm
- Datasheets
- 5SGXEB6R2F40C2N
FPGAs Altera (Intel) 5SGXEB6R2F40C2N Overview
Introducing the FPGAs Altera (Intel) 5SGXEB6R2F40C2N, a highly sophisticated IC FPGA designed to meet the demanding needs of modern digital systems. This field-programmable gate array from Altera, now part of Intel, features an impressive array of 432 I/O pins housed within a compact 1517FBGA package. The device is engineered for optimal flexibility and high-performance scalability, making it an ideal choice for developers looking to push the boundaries of technology in various high-stake applications.
5SGXEB6R2F40C2N Features
The 5SGXEB6R2F40C2N FPGA boasts a robust set of features designed for versatile applications. It offers a large number of input/output options that facilitate complex and multi-faceted designs. The high-density ball grid array (BGA) packaging ensures a reliable and durable connection, while the advanced silicon features provide excellent speed-grade options for enhanced performance.
5SGXEB6R2F40C2N Applications
- Data Centers: Utilized in server infrastructure to manage data flow and processing, enhancing computational efficiency and reliability.
- Telecommunications: Essential for the development of telecommunications equipment, enabling rapid signal processing and increased bandwidth capabilities.
- Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) for real-time processing of sensor data, ensuring safer driving experiences.
- Industrial Automation: Integral to the control systems in manufacturing processes, improving operational efficiency and precision.
- Aerospace and Defense: Used in navigation systems and avionic controls, providing the necessary robustness and performance in critical environments.
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