5SGXEA7N3F40C4N

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Mfr.Part #
5SGXEA7N3F40C4N
Manufacturer
Altera (Intel)
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1517FBGA
Stock
38,210
In Stock :
38,210

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Package / Case :
1517-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
51200000
Number of Inputs :
600
Base Part Number :
5SGXEA7
Number of Outputs :
600
Terminal Form :
Ball
Height Seated (Max) :
3.5mm
Supply Voltage :
0.85V
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Packaging :
Tray
Number of LABs/CLBs :
234720
Length :
40mm
Terminal Position :
BOTTOM
RoHS Status :
RoHS Compliant
Width :
40mm
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B1517
Number of I/O :
600
Voltage - Supply :
0.82V~0.88V
Series :
Stratix® V GX
Number of Logic Elements/Cells :
622000
Factory Lead Time :
8 Weeks
Organization :
23472 CLBS
Power Supplies :
0.851.52.52.5/31.2/3V
Datasheets
5SGXEA7N3F40C4N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA7N3F40C4N from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:1517-BBGA, FCBGA, Base Part Number:5SGXEA7, 5SGXEA7N3F40C4N pinout, 5SGXEA7N3F40C4N datasheet PDF, 5SGXEA7N3F40C4N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 5SGXEA7N3F40C4N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 5SGXEA7N3F40C4N


FPGAs Altera (Intel) 5SGXEA7N3F40C4N Overview

The FPGAs Altera (Intel) 5SGXEA7N3F40C4N is a high-performance, field-programmable gate array designed to meet the evolving needs of a wide range of industries. Engineered by Intel's Altera division, this FPGA stands out for its advanced integration capabilities, enabling developers to harness superior computational power and flexibility. It features a dense architecture housed in a 1517-pin fine-pitch ball grid array (FBGA) package, facilitating robust design scalability and accelerated data processing speeds necessary for complex applications. The versatility of the 5SGXEA7N3F40C4N makes it an ideal choice for designers aiming to optimize system performance while reducing operational costs and time-to-market.

5SGXEA7N3F40C4N Features

This FPGA is equipped with 600 user I/Os, providing ample connectivity options for various peripheral devices. The integration of high-speed transceivers allows for efficient data transfer, supporting advanced communication protocols. Its customizable logic blocks and adaptive logic modules enhance the device's ability to perform multiple functions simultaneously, increasing system efficiency and reliability in demanding environments.

5SGXEA7N3F40C4N Applications

  • Data Centers: Utilized for accelerating compute-intensive applications such as data encryption and traffic management, enhancing overall data center performance and efficiency.
  • Telecommunications: Applied in network infrastructure to support high-speed data transmission and advanced signal processing capabilities, crucial for 5G technology implementation and maintenance.
  • Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to perform real-time image processing and sensor data analysis, improving vehicle safety and navigation.
  • Industrial Automation: Used in control systems to manage complex operations, automate processes, and increase manufacturing precision and productivity.
  • Consumer Electronics: Integrated into devices requiring high-performance graphic processing and multi-tasking capabilities, such as smart TVs and gaming consoles.
This HTML content is designed to effectively communicate the key aspects of the FPGA, focusing on technical features and specific applications tailored to the needs of business clients, highlighting how the FPGA integrates into various high-demand environments.
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