5SGXEA4H3F35I3LN
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- Mfr.Part #
- 5SGXEA4H3F35I3LN
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 552 I/O 1152FBGA
- Stock
- 9,636
- In Stock ：
- 9,636
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Surface Mount :
- yes
- Number of Logic Elements/Cells :
- 420000
- Qualification Status :
- Not Qualified
- Length :
- 35mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-30 Code :
- S-PBGA-B1152
- Organization :
- 15850 CLBS
- Voltage - Supply :
- 0.82V~0.88V
- Total RAM Bits :
- 37888000
- Series :
- Stratix® V GX
- Width :
- 35mm
- Terminal Pitch :
- 1mm
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Base Part Number :
- 5SGXEA4
- Packaging :
- Tray
- Height Seated (Max) :
- 3.6mm
- RoHS Status :
- RoHS Compliant
- Number of LABs/CLBs :
- 158500
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 1152-BBGA, FCBGA
- Number of Outputs :
- 552
- Number of I/O :
- 552
- Power Supplies :
- 0.851.52.52.5/31.2/3V
- Factory Lead Time :
- 8 Weeks
- Number of Inputs :
- 552
- Supply Voltage :
- 0.85V
- Operating Temperature :
- -40°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Datasheets
- 5SGXEA4H3F35I3LN
FPGAs Altera 5SGXEA4H3F35I3LN Overview
The FPGAs Altera 5SGXEA4H3F35I3LN, manufactured by Intel's Altera division, represents a sophisticated blend of high-performance and flexibility in the realm of integrated circuits. Designed for demanding applications that require significant logic density and high I/O count, this FPGA is housed in a compact 1152FBGA package, ensuring a reduced footprint while maximizing functionality. The ability to reprogram these FPGAs post-deployment allows for unparalleled adaptability in response to evolving technological needs, making it an ideal choice for developers looking to future-proof their systems.
5SGXEA4H3F35I3LN Features
This FPGA boasts 552 I/O pins, providing extensive connectivity options for various peripheral devices. The high pin count supports complex, multi-layered designs that are typical in advanced digital systems. Furthermore, its integration in a 1152-pin FBGA package not only enhances the robustness of the device but also facilitates better thermal management and signal integrity, crucial for maintaining performance under intense operational conditions.
5SGXEA4H3F35I3LN Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, the high I/O count allows for efficient data movement between the FPGA and other server components, enhancing overall data throughput and reliability.
- Telecommunications: Deployed in telecommunications infrastructure to manage signal processing operations. Its ability to handle vast amounts of I/O makes it suitable for high-speed, real-time communication applications.
- Automotive Technology: Integrated into advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, ensuring rapid response times and reliable operation in safety-critical applications.
- Medical Imaging: Employed in medical imaging devices such as MRI and ultrasound scanners, where its processing power helps in rendering high-resolution images rapidly, aiding in faster and more accurate diagnoses.
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