5962F1120201QXA

Manufacturer :

Infineon Technologies

Product Category :

Memory

Organization :

2MX36

Operating Temperature :

-55°C~125°C TA

Access Time (Max) :

0.85 ns

Supply Voltage-Min (Vsup) :

1.7V

Height Seated (Max) :

5.38mm

Memory Width :

36

Factory Lead Time :

28 Weeks

Screening Level :

MIL-STD-883

HTS Code :

8542.32.00.41

Memory Interface :

Parallel

Additional Feature :

PIPELINED ARCHITECTURE

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Width :

21mm

Memory Format :

SRAM

Terminal Position :

BOTTOM

I/O Type :

Separate

Memory Size :

72Mb 2M x 36

Memory Type :

Volatile

Terminal Pitch :

1.27mm

Mounting Type :

Through Hole

ECCN Code :

3A991.B.2.A

Package / Case :

165-BFCCGA

Number of Terminations :

165

Packaging :

Tray

Output Characteristics :

3-STATE

RoHS Status :

ROHS3 Compliant

Clock Frequency :

250MHz

Number of Pins :

165

Memory Density :

75497472 bit

Length :

25mm

Supply Current-Max :

1.7mA

Supply Voltage-Max (Vsup) :

1.9V

Power Supplies :

1.8V

Standby Current-Max :

0.66A

Surface Mount :

yes

Number of Functions :

1

Qualification Status :

Qualified

Voltage - Supply :

1.7V~1.9V

Supply Voltage :

1.8V