2010221204
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- Mfr.Part #
- 2010221204
- Manufacturer
- Molex
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 4POS 1.27MM
- Stock
- 10,127
- In Stock ：
- 10,127
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- Manufacturer :
- Molex
- Product Category :
- Headers, Male Pins
- Pbfree Code :
- yes
- Mounting Type :
- Through Hole
- Insulation Color :
- Black
- Connector Type :
- Header
- Number of Rows :
- 2
- Number of Positions Loaded :
- All
- Contact Length - Post :
- 0.094 2.40mm
- Contact Type :
- Male Pin
- Material Flammability Rating :
- UL94 V-0
- Voltage - Rated :
- 125V
- Termination :
- Solder
- Contact Finish Thickness - Post :
- 78.7μin 2.00μm
- Contact Material :
- COPPER ALLOY
- Insulation Height :
- 0.280 7.10mm
- RoHS Status :
- ROHS3 Compliant
- Contact Finish - Post :
- Tin
- Insulation Material :
- Liquid Crystal Polymer (LCP), Glass Filled
- Fastening Type :
- Latch Holder
- Packaging :
- Tube
- Contact Shape :
- Square
- Style :
- Board to Board
- Operating Temperature :
- -55°C~105°C
- Row Spacing - Mating :
- 0.050 (1.27mm)
- Applications :
- Automotive, General Purpose, Telecommunications
- Shrouding :
- Shrouded - 4 Wall
- Series :
- Slim-Grid 201022
- Pitch - Mating :
- 0.050 1.27mm
- Contact Finish - Mating :
- Gold
- Number of Positions :
- 4
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Datasheets
- 2010221204
Slim-Grid 201022 Series 2-Row Header Solder Copper Alloy Tube Through Hole Gold Liquid Crystal Polymer (LCP), Glass Filled 4-Position Board to Board 0.280 7.10mm Height
2010221204 Overview
Packaging for this item is Header.There is a mounting type of Through Hole for this device.It is necessary to use a Tube case for packaging the product.This product is part of the Slim-Grid 201022 Series.A possible application for the device is Automotive, General Purpose, Telecommunications.In this case, the device operates at -55°C~105°C Operating Temperature.
2010221204 Features
Slim-Grid 201022 series
2010221204 Applications
There are a lot of Molex
2010221204 Rectangular Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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