10AX032H3F35E2SG

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Mfr.Part #
10AX032H3F35E2SG
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 384 I/O 1152FBGA
Stock
32,016
In Stock :
32,016

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Total RAM Bits :
21040128
Number of Outputs :
384
Length :
35mm
Operating Temperature :
0°C~100°C TJ
JESD-30 Code :
S-PBGA-B1152
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Surface Mount :
yes
Package / Case :
1152-BBGA, FCBGA
Series :
Arria 10 GX
Terminal Position :
BOTTOM
Supply Voltage :
0.9V
Number of I/O :
384
RoHS Status :
RoHS Compliant
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Qualification Status :
Not Qualified
Number of Inputs :
384
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Number of LABs/CLBs :
119900
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Power Supplies :
0.9V
Width :
35mm
Terminal Form :
Ball
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
320000
Voltage - Supply :
0.87V~0.93V
Height Seated (Max) :
3.5mm
Datasheets
10AX032H3F35E2SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032H3F35E2SG from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, 10AX032H3F35E2SG pinout, 10AX032H3F35E2SG datasheet PDF, 10AX032H3F35E2SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032H3F35E2SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX032H3F35E2SG


FPGAs Altera 10AX032H3F35E2SG Overview

The FPGAs Altera 10AX032H3F35E2SG by Intel is a high-performance integrated circuit specifically designed for applications requiring flexible, high-speed programmable logic solutions. This device is part of the Arria 10 family, renowned for its superior processing capabilities and advanced features. Equipped with 384 I/O pins housed in a 1152FBGA package, this FPGA offers a robust platform for developing complex digital computing tasks essential in modern electronic devices. The integration of this FPGA enables developers to achieve significant improvements in performance and flexibility, ensuring a competitive edge in rapidly evolving markets.

10AX032H3F35E2SG Features

This FPGA features a rich set of capabilities including a high I/O count, a dense ball grid array (BGA) packaging, and compatibility with advanced digital signal processing. The 10AX032H3F35E2SG supports high-speed transceiver data rates and enhanced power efficiency, which makes it ideal for high-throughput applications that require extensive data processing and manipulation.

10AX032H3F35E2SG Applications

  • Telecommunications: This FPGA is used in networking equipment such as routers and switches, enabling high-speed data transmission and advanced network management.
  • Data Centers: In data centers, the 10AX032H3F35E2SG manages complex data-processing tasks, improving the efficiency of storage and server operations.
  • Aerospace and Defense: This device is critical in the development of aerospace systems, where high reliability and the ability to function under extreme conditions are required.
  • Automotive: Employed in advanced driver-assistance systems (ADAS), the FPGA processes multiple real-time inputs from vehicle sensors to enhance safety features.
  • Industrial Automation: In industrial settings, this FPGA facilitates process control, machine vision, and robotic applications, enabling smarter, faster automation solutions.
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