10AX032H2F35I2SG

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Mfr.Part #
10AX032H2F35I2SG
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 384 I/O 1152FBGA
Stock
4,034
In Stock :
4,034

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
8 Weeks
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Qualification Status :
Not Qualified
Surface Mount :
yes
HTS Code :
8542.39.00.01
Packaging :
Tray
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Series :
Arria 10 GX
Length :
35mm
Number of LABs/CLBs :
119900
Number of Logic Elements/Cells :
320000
Power Supplies :
0.9V
RoHS Status :
RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
21040128
Voltage - Supply :
0.87V~0.98V
Number of I/O :
384
Number of Outputs :
384
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Inputs :
384
Terminal Form :
Ball
Supply Voltage :
0.9V
Package / Case :
1152-BBGA, FCBGA
Height Seated (Max) :
3.5mm
Width :
35mm
JESD-30 Code :
S-PBGA-B1152
Terminal Position :
BOTTOM
Datasheets
10AX032H2F35I2SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032H2F35I2SG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, 10AX032H2F35I2SG pinout, 10AX032H2F35I2SG datasheet PDF, 10AX032H2F35I2SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032H2F35I2SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX032H2F35I2SG


FPGAs Altera (Intel) 10AX032H2F35I2SG Overview

Introducing the FPGAs Altera (Intel) 10AX032H2F35I2SG, a high-performance integrated circuit from the renowned manufacturer Intel (formerly Altera). Designed for versatility and peak efficiency, this field-programmable gate array (FPGA) offers a robust solution for developers requiring high-speed data processing and flexible hardware configuration. Its compact 1152FBGA package encapsulates a powerhouse capable of supporting complex digital systems. Ideal for demanding applications, this FPGA ensures that enterprises can leverage cutting-edge technology for their computational and logic requirements, streamlining operations and enhancing system performance.

10AX032H2F35I2SG Features

The 10AX032H2F35I2SG FPGA boasts an impressive array of features designed to meet the needs of modern electronics. Key features include:

  • 384 I/O Pins: Provides ample interfacing capability with other components of electronic systems, facilitating complex and multi-faceted designs.
  • High-Density Integration: Features a 1152 ball grid array package, which ensures a compact form factor without compromising on the processing power and the ability to handle numerous simultaneous tasks.
  • Configurable Logic Blocks: Offers extensive adaptability through customizable logic blocks, allowing designers to tailor the device to specific applications or requirements.
  • Advanced Security Features: Incorporates robust security protocols to protect against unauthorized access and tampering, essential for applications in sensitive or critical environments.

10AX032H2F35I2SG Applications

  • Data Centers: Enhances processing capabilities and manages multiple operations simultaneously, crucial for maintaining high efficiency in data management and storage systems.
  • Telecommunication Infrastructure: Utilized in telecommunication systems to process vast amounts of data with high reliability and speed, ensuring seamless network performance and connectivity.
  • Automotive Technology: Supports advanced driver-assistance systems (ADAS) by processing real-time inputs from vehicle sensors, thereby enhancing safety and performance.
  • Industrial Automation: Drives the automation of complex industrial processes by providing customizable logic configurations, significantly improving operational efficiency and reliability.
  • Consumer Electronics: Integral in the development of consumer electronics, such as high-performance gaming consoles and smart home systems, providing the necessary processing power and flexibility.
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