10AX032E3F27E2SG
- Mfr.Part #
- 10AX032E3F27E2SG
- Manufacturer
- Altera (Intel)
- Package / Case
- 672-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 240 I/O 672FBGA
- Stock
- 11,120
- In Stock :
- 11,120
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~100°C TJ
- Surface Mount :
- yes
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 0.9V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- Number of Inputs :
- 240
- Package / Case :
- 672-BBGA, FCBGA
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Number of LABs/CLBs :
- 119900
- RoHS Status :
- RoHS Compliant
- Number of Logic Elements/Cells :
- 320000
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 8 Weeks
- Length :
- 27mm
- Number of Outputs :
- 240
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 0.87V~0.93V
- Power Supplies :
- 0.9V
- Number of I/O :
- 240
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- Arria 10 GX
- Height Seated (Max) :
- 3.25mm
- JESD-30 Code :
- S-PBGA-B672
- Width :
- 27mm
- Number of Terminations :
- 672
- Total RAM Bits :
- 21040128
- Datasheets
- 10AX032E3F27E2SG

FPGAs Altera (Intel) 10AX032E3F27E2SG Overview
The FPGAs Altera (Intel) 10AX032E3F27E2SG is a high-performance, field-programmable gate array designed to meet the demands of advanced digital processing systems. This IC FPGA from Altera, now part of Intel, integrates robust flexibility with 240 I/O pins and a 672-ball fine-pitch BGA package, ensuring it can handle a variety of configurations and designs. The device is optimized for efficiency and high-speed operation, making it an ideal choice for developers looking to push the boundaries of technology in various industrial applications. Incorporating this FPGA into your systems ensures a scalable and future-proof hardware environment, crucial for rapid development and deployment of complex applications.
10AX032E3F27E2SG Features
This FPGA boasts a dynamic feature set suitable for a robust array of applications. It supports a wide configuration of I/O pins, which provides substantial versatility in interfacing with other digital components. The 672FBGA package is engineered for optimal thermal management and minimal footprint on system boards. Furthermore, its integration with Intel's technology leverages advanced node capabilities, enhancing both performance and power efficiency.
10AX032E3F27E2SG Applications
- Telecommunications Equipment: Utilized in routers, switches, and base stations to facilitate efficient data flow and signal processing.
- Data Centers: Enhances processing capabilities within servers and storage units, contributing to faster data access and improved reliability.
- Automotive Electronics: Employs in driver assistance systems and infotainment to enhance functionality and performance.
- Industrial Automation: Critical in control systems for real-time processing and machine-to-machine communication.
- Medical Devices: Used in diagnostic and imaging equipment to process complex data sets and support advanced health technology.
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