10AX027E4F29I3SG

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Mfr.Part #
10AX027E4F29I3SG
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780FBGA
Stock
13,966
In Stock :
13,966

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
360
Surface Mount :
yes
Qualification Status :
Not Qualified
Number of LABs/CLBs :
101620
Height Seated (Max) :
3.35mm
Number of I/O :
360
Voltage - Supply :
0.87V~0.98V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
JESD-30 Code :
S-PBGA-B780
Length :
29mm
Terminal Form :
Ball
Terminal Position :
BOTTOM
Number of Terminations :
780
HTS Code :
8542.39.00.01
Number of Outputs :
360
Power Supplies :
0.9V
RoHS Status :
RoHS Compliant
Supply Voltage :
0.9V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Pitch :
1mm
Series :
Arria 10 GX
Width :
29mm
Factory Lead Time :
8 Weeks
Operating Temperature :
-40°C~100°C TJ
Number of Logic Elements/Cells :
270000
Package / Case :
780-BBGA, FCBGA
Packaging :
Tray
Total RAM Bits :
17870848
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
10AX027E4F29I3SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E4F29I3SG from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:780-BBGA, FCBGA, 10AX027E4F29I3SG pinout, 10AX027E4F29I3SG datasheet PDF, 10AX027E4F29I3SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E4F29I3SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027E4F29I3SG


FPGAs Altera (Intel) 10AX027E4F29I3SG Overview

The FPGAs Altera (Intel) 10AX027E4F29I3SG is a highly versatile and performance-oriented field-programmable gate array designed by Intel. Specifically built for demanding applications, this IC offers a robust solution for developers requiring high-speed data processing and flexible hardware customization. With its substantial I/O capabilities and a compact 780FBGA package, this FPGA is ideal for streamlined yet complex designs that necessitate a high level of integration and performance efficiency. This product stands out in the market due to its adaptability and the extensive support provided by Intel, making it a prime choice for enterprises looking to leverage cutting-edge technology in their products.

10AX027E4F29I3SG Features

This FPGA model boasts 360 I/O pins, which are essential for complex, multi-functional devices requiring numerous connections both internally and externally. The integration in a 780FBGA package not only ensures a reduced footprint on the system board but also enhances thermal management and reliability under varied operational conditions. Moreover, the advanced silicon features embedded by Intel guarantee high-speed performance and lower power consumption, making it suitable for a wide range of industrial applications.

10AX027E4F29I3SG Applications

  • Telecommunications Equipment: Utilized in routers and switches, the 10AX027E4F29I3SG manages high-speed signal processing tasks efficiently, enhancing data flow and connectivity.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple real-time inputs from sensors and cameras, ensuring rapid response and reliability.
  • Medical Imaging: Applied in devices like MRI and ultrasound machines, offering the necessary computation power for real-time image processing and diagnostic accuracy.
  • Industrial Automation: Enables smarter control systems in factories, including robotics and assembly lines, where precision and adaptability are crucial.
  • Data Centers: Critical in managing complex data processing tasks within servers that require high bandwidth and low latency for optimal performance.
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