10AX027E3F29E2SG

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Mfr.Part #
10AX027E3F29E2SG
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780FBGA
Stock
21,663
In Stock :
21,663

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Series :
Arria 10 GX
Packaging :
Tray
JESD-30 Code :
S-PBGA-B780
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Number of I/O :
360
Number of Terminations :
780
Height Seated (Max) :
3.35mm
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Number of LABs/CLBs :
101620
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
360
Width :
29mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Total RAM Bits :
17870848
Power Supplies :
0.9V
Operating Temperature :
0°C~100°C TJ
Number of Logic Elements/Cells :
270000
Supply Voltage :
0.9V
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Inputs :
360
Package / Case :
780-BBGA, FCBGA
Voltage - Supply :
0.87V~0.93V
Length :
29mm
Mounting Type :
Surface Mount
Datasheets
10AX027E3F29E2SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F29E2SG from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Operating Temperature:0°C~100°C TJ, Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, 10AX027E3F29E2SG pinout, 10AX027E3F29E2SG datasheet PDF, 10AX027E3F29E2SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F29E2SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027E3F29E2SG


FPGAs Altera (Intel) 10AX027E3F29E2SG Overview

The FPGAs Altera (Intel) 10AX027E3F29E2SG is a high-performance integrated circuit designed by Intel, previously known as Altera, tailored for advanced digital processing tasks. This FPGA leverages a 780-pin FineLine BGA (FBGA) package, providing robust support for a wide range of functionalities with its 360 I/O pins. It is engineered to meet the increasing demands of sophisticated electronic environments, offering a flexible, high-density solution for system integration. This product stands out in the market for its adaptability and efficiency, making it an ideal choice for developers looking to enhance system performance with scalable FPGA technology.

10AX027E3F29E2SG Features

The 10AX027E3F29E2SG FPGA boasts a variety of features that enhance its utility and performance in complex electronics systems. These include a large number of input/output pins, which provide significant flexibility in interfacing with other components. The FPGA architecture facilitates rapid prototyping and modifications, allowing for quicker iterations during development phases. Additionally, the use of a FBGA package ensures improved thermal management and reduced footprint on the PCB, which is crucial for high-density electronic assemblies.

10AX027E3F29E2SG Applications

  • Data Centers: Utilized in server architectures to enhance data processing speeds and efficiency. This FPGA can handle complex algorithms essential for managing large data sets and high-speed transactions.
  • Telecommunications: Critical in the development of communication infrastructure, enabling high-speed signal processing which is vital for 5G networks and beyond.
  • Industrial Automation: Employs advanced control systems, improving operational efficiency and reliability in manufacturing processes through adaptable hardware configurations.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing real-time data from vehicle sensors, contributing to safer driving experiences.
  • Medical Devices: Enhances functionality and reliability of medical imaging equipment, such as MRI and ultrasound machines, by facilitating the handling of complex image processing tasks efficiently.
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