10AX027E3F29E2LG

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Mfr.Part #
10AX027E3F29E2LG
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780FBGA
Stock
21,256
In Stock :
21,256

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.87V~0.93V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Pitch :
1mm
Packaging :
Tray
Surface Mount :
yes
Number of Inputs :
360
Number of I/O :
360
Qualification Status :
Not Qualified
Package / Case :
780-BBGA, FCBGA
Power Supplies :
0.9V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
29mm
Width :
29mm
Height Seated (Max) :
3.35mm
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
270000
RoHS Status :
RoHS Compliant
Number of Outputs :
360
Total RAM Bits :
17870848
Operating Temperature :
0°C~100°C TJ
Terminal Position :
BOTTOM
Number of LABs/CLBs :
101620
JESD-30 Code :
S-PBGA-B780
Factory Lead Time :
8 Weeks
Number of Terminations :
780
Mounting Type :
Surface Mount
Series :
Arria 10 GX
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage :
0.9V
Datasheets
10AX027E3F29E2LG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F29E2LG from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Number of Terminations:780, Mounting Type:Surface Mount, 10AX027E3F29E2LG pinout, 10AX027E3F29E2LG datasheet PDF, 10AX027E3F29E2LG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F29E2LG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027E3F29E2LG


FPGAs Altera (Intel) 10AX027E3F29E2LG Overview

The FPGAs Altera (Intel) 10AX027E3F29E2LG is a high-performance field-programmable gate array designed for advanced system-level integration. Manufactured by Intel's Altera division, this IC FPGA features a dense 780-pin FBGA (Fine-pitch Ball Grid Array) package, making it suitable for compact yet demanding applications. This product stands out for its capacity to handle complex logic operations and data processing tasks with exceptional efficiency and flexibility. Ideal for developers aiming to push the boundaries of technology in high-speed computing and signal processing, the 10AX027E3F29E2LG facilitates robust system architecture designs with its scalable configuration and extensive I/O capabilities.

10AX027E3F29E2LG Features

This FPGA boasts 360 I/O pins, allowing for extensive connectivity options and versatile application use. It supports a variety of logic density configurations, which ensures adaptability for both high-volume and niche applications. The device is engineered to meet the rigorous demands of high-speed digital signal processing, featuring integrated DSP blocks that enhance performance for complex algorithms. Additionally, the 10AX027E3F29E2LG is equipped with advanced security features, providing robust protection against physical and intellectual threats, which is crucial for sensitive applications.

10AX027E3F29E2LG Applications

  • Telecommunications Equipment: Utilized for processing and managing high-speed data transfers within network infrastructure, enhancing bandwidth and signal integrity.
  • Automotive Driver Assistance Systems: Acts as a control unit for managing sensors and cameras, improving vehicle safety and functionality through advanced driver-assistance systems (ADAS).
  • Medical Imaging Devices: Helps in the processing of complex imaging data, ensuring quick and accurate diagnostics in medical technology.
  • Industrial Automation: Empowers smart factories by controlling machinery and industrial robots, offering precision and adaptability in automated processes.
  • Consumer Electronics: Used in high-definition multimedia interfaces and virtual reality systems, providing the necessary computing power to deliver immersive user experiences.
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