10AX027E3F27E2LG

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Mfr.Part #
10AX027E3F27E2LG
Manufacturer
Altera (Intel)
Package / Case
672-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 240 I/O 672FBGA
Stock
15,632
In Stock :
15,632

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Qualification Status :
Not Qualified
Supply Voltage :
0.9V
Terminal Position :
BOTTOM
Surface Mount :
yes
Number of Outputs :
240
Number of Inputs :
240
RoHS Status :
RoHS Compliant
Number of Terminations :
672
Width :
27mm
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Height Seated (Max) :
3.25mm
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
17870848
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
672-BBGA, FCBGA
Packaging :
Tray
Number of LABs/CLBs :
101620
Length :
27mm
Number of I/O :
240
Power Supplies :
0.9V
JESD-30 Code :
S-PBGA-B672
Operating Temperature :
0°C~100°C TJ
Voltage - Supply :
0.87V~0.93V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Logic Elements/Cells :
270000
Series :
Arria 10 GX
Datasheets
10AX027E3F27E2LG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F27E2LG from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:672, Mounting Type:Surface Mount, Package / Case:672-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, 10AX027E3F27E2LG pinout, 10AX027E3F27E2LG datasheet PDF, 10AX027E3F27E2LG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027E3F27E2LG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027E3F27E2LG


FPGAs Altera (Intel) 10AX027E3F27E2LG Overview

The FPGAs Altera (Intel) 10AX027E3F27E2LG represents a high-performance integrated circuit engineered by Intel's Altera division. Designed to cater to a myriad of demanding applications, this FPGA (Field Programmable Gate Array) offers a flexible and efficient solution for system design. The 10AX027E3F27E2LG, housed in a 672-pin FBGA (Fine-pitch Ball Grid Array) package, features a robust 240 I/O interface that supports a variety of design requirements. This product stands out for its advanced capabilities in handling complex digital computations and real-time processing tasks, making it an essential component for developers looking to optimize their electronic designs for performance and scalability.

10AX027E3F27E2LG Features

This FPGA is equipped with a range of features that enhance its usability and functionality in complex digital environments. Key attributes include a high I/O count which facilitates extensive interfacing with other components, advanced security protocols for protecting intellectual property and data during operation, and a fine-pitched ball grid array for improved heat dissipation and reduced footprint on system boards. The versatility and power efficiency of the 10AX027E3F27E2LG make it an ideal choice for high-density applications that require reliable and continuous operation.

10AX027E3F27E2LG Applications

  • Data Centers: Utilized in server infrastructure to manage data flow and signal processing, enhancing efficiency and processing capabilities in high-demand environments.
  • Telecommunications: Plays a critical role in communication infrastructure by facilitating signal integrity and data transmission speed in routers and switches.
  • Automotive Electronics: Used in driver assistance systems to process real-time data from sensors and cameras, ensuring rapid response times and system reliability.
  • Industrial Automation: Enhances control systems in manufacturing processes by providing adaptable logic configurations that optimize operational efficiency and safety.
  • Medical Devices: Integral to the development of medical imaging systems, where its processing power and I/O capabilities help in delivering precise and fast imaging results.
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