10AX027E2F29E1HG
- Mfr.Part #
- 10AX027E2F29E1HG
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 780FBGA
- Stock
- 22,502
- In Stock :
- 22,502
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Arria 10 GX
- RoHS Status :
- RoHS Compliant
- Number of LABs/CLBs :
- 101620
- Total RAM Bits :
- 17870848
- Operating Temperature :
- 0°C~100°C TJ
- Number of Logic Elements/Cells :
- 270000
- Package / Case :
- 780-BBGA, FCBGA
- Factory Lead Time :
- 8 Weeks
- Supplier Device Package :
- 780-FBGA (29x29)
- Mounting Type :
- Surface Mount
- Number of I/O :
- 360
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Voltage - Supply :
- 0.87V~0.98V
- Datasheets
- 10AX027E2F29E1HG

FPGAs Altera (Intel) 10AX027E2F29E1HG Overview
The FPGAs Altera (Intel) 10AX027E2F29E1HG is an advanced field-programmable gate array designed for high-performance, multi-functional applications across various industries. Manufactured by Intel's Altera division, this FPGA leverages state-of-the-art technology to provide a highly flexible and configurable solution embedded within a compact 780FBGA package. Its extensive I/O capabilities make it ideal for applications requiring high-speed data processing and connectivity, ensuring efficient and reliable performance. The integration of this FPGA into your projects can significantly enhance system capabilities, allowing for accelerated development cycles and improved product performance.
10AX027E2F29E1HG Features
- High-density integration with 360 I/O pins for versatile connectivity.
- Compact 780-pin Fine-Pitch Ball Grid Array (FBGA) package for reduced space requirements.
- Optimized for low power consumption, enhancing overall system efficiency.
- Supported by Intel's sophisticated Quartus Prime design software for easier programming and deployment.
10AX027E2F29E1HG Applications
- Telecommunications Equipment: Utilized in routers and switches for signal integrity and data throughput enhancements.
- Data Center Infrastructure: Supports server farms and storage arrays with high-speed data processing and large-scale connectivity.
- Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process real-time sensor data and support vehicle safety enhancements.
- Medical Devices: Integrates into imaging systems and diagnostic equipment for improved processing power and operational efficiency.
- Industrial Automation: Facilitates robust control systems and complex machine-to-machine communications in manufacturing processes.
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